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Report Scope & Overview:

SIC Wafer Polishing Market size was valued at USD 0.36 billion in 2022 and is expected to grow to USD 4.57 billion by 2030 and grow at a CAGR of 37.4% over the forecast period of 2023-2030.

The 4 Inch SiC Wafer and the 6 Inch SiC Wafer are the two categories that make up the market. According to projections, 6 Inch SiC Wafer will rule the market. This is attributed to its remarkable heat resistance, substantial thermal capacity, high-speed bandwidth, and efficiency. Also, it is predicted that the demand for 4 Inch SiC Wafer will rise gradually during the projection period. as a result of characteristics like insulation, enhanced electronic capabilities, and resistance to corrosion, erosion, and oxidation. Due to its unique ability to provide a highly regulated and perfect polishing operation, the chemical mechanical polishing (CMP) segment is anticipated to be the most significant by application in the global wafer polishing market over the forecast period. CMP integrates chemical processes better planarization and smoothness on the surface of SiC fluids, both of which are necessary for high-performance semiconductor devices. Its ability to handle higher water volumes and compatibility with various SiC substrate types, which meet the objectives of the semiconductor industry for advanced applications, further contribute to its success. Furthermore, CMP is a recommended technique for creating dependable and high-quality devices because of its effectiveness in removing faults and impurities from SiC wafers.

SIC Wafer Polishing Market Revenue Analysis

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KEY DRIVERS:

  • Creation of cutting-edge polishing supplies

The SiC wafer polishing market's expansion is significantly impacted by the development of sophisticated polishing consumables. Wafer polishing supplies, including as abrasive slurries, pads, and chemicals, are known as polishing consumables. The SiC wafer polishing market has benefited in a number of ways from improvements in these consumables, spurring both growth and efficiency. Modern polishing consumables have the ability to polish wafers with more precision and consistency, which is one of their main benefits. The need for precise and reliable polishing is increasing as SiC wafers get thinner and more intricate in their design. In order to increase overall wafer quality, advanced consumables are designed to give users greater control over material removal rates, surface roughness, and planarization.

  • Increasing Use of Consumer Electronics

  • Sic Wafers are being used in radio frequency (RF) devices

RESTRAIN:

  • Long cycle polishing times

The SiC wafer polishing market's prolonged polishing cycle time may significantly affect and possibly impede market growth. Due to its remarkable characteristics, including as high-temperature resistance, high power density, and low power loss, SIC wafers are widely used in a range of industries, including power electronics, automotive, telecommunications, and aerospace. But a crucial and time-consuming step in the manufacturing of SiC wafers is the polishing procedure. The capacity and throughput of SiC wafers are directly impacted by the lengthened polishing cycle time. It has an impact on overall manufacturing efficiency and reduces the rate at which finished wafers can be produced because the polishing process takes longer.

  • Surface contamination and a small supplier base

OPPORTUNITY:

  • Technological advancements in polishing

The SiC wafer polishing market now has a sizable window of opportunity thanks to developments in polishing technologies. More effective, accurate, and economical polishing techniques are needed as SiC wafer demand rises. Modern polishing technology advancements enable improved process control, improved surface quality, and increased productivity. The opportunity lies in the ability of the SiC wafer polishing market to accept these advancements and offer cutting-edge solutions. By implementing and perfecting novel polishing procedures, the industry can accommodate the shifting requirements of SiC wafer producers and end users. Advanced polishing techniques can solve surface defects, uniformity, and dimensional control, ensuring the production of highly polished SIC wafers. Chemical mechanical planarization (CMP) procedures, new slurries, and enhanced optimization are some advancements in polishing technology.

  • Growing Investments in Sic R&D, New Applications, and Polishing Technology Advancements

CHALLENGES:

  • Market consolidation and fierce rivalry are obstacles

Due to fierce competition and industry consolidation, the SiC wafer polishing market is faced with significant obstacles. With more companies competing for market share, the sector is becoming more competitive as demand for SiC wafers rises. This competition increases pricing pressure and reduces profit margins, which has an impact on the profitability and long-term viability of SiC wafer polishing companies. Market consolidation makes things more difficult. Due to mergers, acquisitions, and strategic alliances, a small number of dominant corporations may control a highly concentrated market. This consolidation could make it more difficult for new firms to enter, which would reduce market diversity and innovation. Smaller businesses may find it difficult to obtain market share and compete with more established firms that already have established client relationships and economies of scale.

  • Manufacturing complexity plus fierce competition and market consolidation

IMPACT OF RUSSIAN UKRAINE WAR

A sensitive supply chain is necessary for silicon wafer production, as the world has discovered over the past few years. A problem in one part of the world may have an impact on wafer production all over the world. You might be wondering whether the present war will have an effect on the business because Russia and Ukraine aren't the nations that generally come to mind when talking about semiconductor manufacture. We'll go over what you should know. Although neither Russia nor Ukraine are big producers of semiconductors, the conflict may nevertheless affect the supply chain. The problem is that neon plays a significant role in the production of semiconductors. I's specifically utilized to make designs on the wafers. The largest neon provider at the moment is Ukraine. In actuality, it supplies more than half of the neon used worldwide. Because neon cannot be manufactured routinely due to the war, it is more difficult for Ukrainian facilities to obtain the supplies they require. Given the existing sanctions, a complete Russian takeover of Ukraine would only make matters worse.

IMPACT OF ONGOING RECESSION

The silicon carbide wafer surface must therefore be extensively polished to completely remove all signs of any scratches and surface flaws. The precise procedure for polishing silicon wafers is inappropriate for silicon carbide since it is twice as hard as silicon. For silicon carbide wafers, conventional optical polishing methods may need 10 days or more to produce an acceptable surface grade. The polishing of silicon carbide wafers takes only a few hours thanks to the current idea. A thin silicon carbide wafer created by sawing a silicon carbide crystal boule is used to create silicon carbide semiconductor devices. A wafer surface that appears smooth after the sawing operation is actually damaged and contains miniscule scratches that are utterly inappropriate for the subsequent epitaxial growth method. The resulting semiconductor device would either not operate or operate with diminished efficiency as a result of the damaged surface.

MARKET SEGMENTATION

By Process Type

  • Mechanical polishing

  • Chemical-mechanical polishing (CMP)

  • Electropolishing

  • Chemical polishing

  • Plasma-assisted polishing

  • Others

By Product Type

  • Abrasive powders

  • Polishing pads

  • Diamond slurries

  • Colloidal silica suspensions

  • Others

By Application

  • Power Electronics

  •  Light-emitting diodes (LEDs)

  •  Sensors and detectors

  •  RF and microwave devices

  • Others

SIC Wafer Polishing Market Segmentation Analysis

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 REGIONAL ANALYSIS

From 2023 to 2028, the Sic wafer polishing market is anticipated to grow at the highest CAGR in the Asia Pacific region. Taking into account these facts, Asia Pacific is one of the largest markets for sic wafer polishing. The region is a major hub for the electronics and semiconductor industry, with nations like China, Japan, South Korea, and Taiwan is a major producer of semiconductors worldwide. The increasing requirement for high-quality polished SiC wafers is being driven by the rising demand for SiC-based products, such as power electronics, RF components, and LEDs encouraging the market for polishing to grow. With a growing population and increasing disposable incomes fueling demand for smartphones, tablets, and other electronic gadgets, the Asia Pacific area is home to a sizable consumer electronics market. The need for polished SiC wafers is being driven further by the rising use of SiC-based power devices in contemporary consumer electronics for improved efficiency and longer battery life.

REGIONAL COVERAGE:

North America

  • US

  • Canada

  • Mexico

Europe

  • Eastern Europe

    • Poland

    • Romania

    • Hungary

    • Turkey

    • Rest of Eastern Europe

  • Western Europe

    • Germany

    • France

    • UK

    • Italy

    • Spain

    • Netherlands

    • Switzerland

    • Austria

    • Rest of Western Europe

Asia Pacific

  • China

  • India

  • Japan

  • South Korea

  • Vietnam

  • Singapore

  • Australia

  • Rest of Asia Pacific

Middle East & Africa

  • Middle East

    • UAE

    • Egypt

    • Saudi Arabia

    • Qatar

    • Rest of Middle East

  • Africa

    • Nigeria

    • South Africa

    • Rest of Africa

Latin America

  • Brazil

  • Argentina

  • Colombia

  • Rest of Latin America

KEY PLAYERS

The key players in the Sic wafer polishing market include Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US) and other players are listed in a final report.

Kemet International (UK)-Company Financial Analysis

RECENT DEVELOPMENT

  • In June 2022, Finland-based, privately held semiconductor equipment business Picosun Oy was bought by Applied Materials. The product portfolio and customer engagements of Applied ICAPS (lol, Communications, Automotive, Power and Sensors) were anticipated to expand as a result of the acquisition.

  • In February 2022, Revasum disclosed that SQN Venture Partners, LLC had granted it a growth capital facility. The facility would offer working capital funding of up to USD 8 million to speed up the development of innovative products money to finance rapid growth.   

SIC Wafer Polishing Market Report Scope:
Report Attributes Details
Market Size in 2022  US$ 0.36 billion 
Market Size by 2030  US$ 4.57 billion
CAGR   CAGR of 37.4%   From 2023 to 2030
Base Year 2022
Forecast Period  2023-2030
Historical Data  2019-2021
Report Scope & Coverage Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segments By Process Type (Mechanical polishing, Chemical-mechanical polishing (CMP), Electropolishing, Chemical polishing, Plasma-assisted polishing, Others), By Product Type (Abrasive powders, Polishing pads, Diamond slurries, Colloidal silica suspensions, Others), By Application (Power Electronics, Light-emitting diodes (LEDs), Sensors and detectors, Rf and microwave devices, Others)
Regional Analysis/Coverage North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia Rest of Latin America)
Company Profiles Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US)
Key Drivers

•Creation of cutting-edge polishing supplies

•Increasing Use of Consumer Electronics

•Sic Wafers are being used in radio frequency (RF) devices

Market Restrain

•Long cycle polishing times                                                      

•Surface contamination and a small supplier base

 

Frequently Asked Questions

Asia Pacific is having highest CAGR in the SIC Wafer Polishing Market.

Market consolidation and fierce rivalry are obstacles and Manufacturing complexity plus fierce competition and market consolidation.

Creation of cutting-edge polishing supplies, Increasing Use of Consumer Electronics and Sic Wafers are being used in radio frequency (RF) devices.

SIC Wafer Polishing Market size was valued at USD 0.36 billion in 2022

 SIC Wafer Polishing Market is anticipated to expand by 37.4% from 2023 to 2030.

Table of Contents

1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions

2. Research Methodology

3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges

4. Impact Analysis
4.1 Impact of the Ukraine- Russia war
4.2 Impact of ongoing Recession
4.2.1 Introduction
4.2.2 Impact on major economies
4.2.2.1 US
4.2.2.2 Canada
4.2.2.3 Germany
4.2.2.4 France
4.2.2.5 United Kingdom
4.2.2.6 China
4.2.2.7 Japan
4.2.2.8 South Korea
4.2.2.9 Rest of the World

5. Value Chain Analysis

6. Porter’s 5 forces model

7. PEST Analysis

8. SIC Wafer Polishing Market Segmentation, By Process Type
8.1    Mechanical polishing
8.2    Chemical-mechanical polishing (CMP)
8.3    Electropolishing
8.4    Chemical polishing
8.5    Plasma-assisted polishing
8.6    Others

9. SIC Wafer Polishing Market Segmentation, By Product Type
9.1    Abrasive powders
9.2    Polishing pads
9.3    Diamond slurries
9.4    Colloidal silica suspensions
9.5    Others

10. SIC Wafer Polishing Market Segmentation, By Application
10.1 Power Electronics
10.2 Light-emitting diodes (LEDs)
10.3 Sensors and detectors
10.4 Rf and microwave devices
10.5 Others

11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1 North America SIC Wafer Polishing Market by Country
11.2.2North America SIC Wafer Polishing Market by Process Type
11.2.3 North America SIC Wafer Polishing Market by Product Type
11.2.4 North America SIC Wafer Polishing Market by Application
11.2.5 USA
11.2.5.1 USA SIC Wafer Polishing Market by Process Type
11.2.5.2 USA SIC Wafer Polishing Market by Product Type
11.2.5.3 USA SIC Wafer Polishing Market by Application
11.2.6 Canada
11.2.6.1 Canada SIC Wafer Polishing Market by Process Type
11.2.6.2 Canada SIC Wafer Polishing Market by Product Type
11.2.6.3 Canada SIC Wafer Polishing Market by Application
11.2.7 Mexico
11.2.7.1 Mexico SIC Wafer Polishing Market by Process Type
11.2.7.2 Mexico SIC Wafer Polishing Market by Product Type
11.2.7.3 Mexico SIC Wafer Polishing Market by Application
11.3 Europe
11.3.1 Eastern Europe
11.3.1.1 Eastern Europe SIC Wafer Polishing Market by Country
11.3.1.2 Eastern Europe SIC Wafer Polishing Market by Process Type
11.3.1.3 Eastern Europe SIC Wafer Polishing Market by Product Type
11.3.1.4 Eastern Europe SIC Wafer Polishing Market by Application
11.3.1.5 Poland
11.3.1.5.1 Poland SIC Wafer Polishing Market by Process Type
11.3.1.5.2 Poland SIC Wafer Polishing Market by Product Type
11.3.1.5.3 Poland SIC Wafer Polishing Market by Application
11.3.1.6 Romania
11.3.1.6.1 Romania SIC Wafer Polishing Market by Process Type
11.3.1.6.2 Romania SIC Wafer Polishing Market by Product Type
11.3.1.6.4 Romania SIC Wafer Polishing Market by Application
11.3.1.7 Turkey
11.3.1.7.1 Turkey SIC Wafer Polishing Market by Process Type
11.3.1.7.2 Turkey SIC Wafer Polishing Market by Product Type
11.3.1.7.3 Turkey SIC Wafer Polishing Market by Application
11.3.1.8 Rest of Eastern Europe
11.3.1.8.1 Rest of Eastern Europe SIC Wafer Polishing Market by Process Type
11.3.1.8.2 Rest of Eastern Europe SIC Wafer Polishing Market by Product Type
11.3.1.8.3 Rest of Eastern Europe SIC Wafer Polishing Market by Application
11.3.2 Western Europe
11.3.2.1 Western Europe SIC Wafer Polishing Market by Process Type
11.3.2.2 Western Europe SIC Wafer Polishing Market by Product Type
11.3.2.3 Western Europe SIC Wafer Polishing Market by Application
11.3.2.4 Germany
11.3.2.4.1 Germany SIC Wafer Polishing Market by Process Type
11.3.2.4.2 Germany SIC Wafer Polishing Market by Product Type
11.3.2.4.3 Germany SIC Wafer Polishing Market by Application
11.3.2.5 France
11.3.2.5.1 France SIC Wafer Polishing Market by Process Type
11.3.2.5.2 France SIC Wafer Polishing Market by Product Type
11.3.2.5.3 France SIC Wafer Polishing Market by Application
11.3.2.6 UK
11.3.2.6.1 UK SIC Wafer Polishing Market by Process Type
11.3.2.6.2 UK SIC Wafer Polishing Market by Product Type
11.3.2.6.3 UK SIC Wafer Polishing Market by Application
11.3.2.7 Italy
11.3.2.7.1 Italy SIC Wafer Polishing Market by Process Type
11.3.2.7.2 Italy SIC Wafer Polishing Market by Product Type
11.3.2.7.3 Italy SIC Wafer Polishing Market by Application
11.3.2.8 Spain
11.3.2.8.1 Spain SIC Wafer Polishing Market by Process Type
11.3.2.8.2 Spain SIC Wafer Polishing Market by Product Type
11.3.2.8.3 Spain SIC Wafer Polishing Market by Application
11.3.2.9 Netherlands
11.3.2.9.1 Netherlands SIC Wafer Polishing Market by Process Type
11.3.2.9.2 Netherlands SIC Wafer Polishing Market by Product Type
11.3.2.9.3 Netherlands SIC Wafer Polishing Market by Application
11.3.2.10 Switzerland
11.3.2.10.1 Switzerland SIC Wafer Polishing Market by Process Type
11.3.2.10.2 Switzerland SIC Wafer Polishing Market by Product Type
11.3.2.10.3 Switzerland SIC Wafer Polishing Market by Application
11.3.2.11.1 Austria
11.3.2.11.2 Austria SIC Wafer Polishing Market by Process Type
11.3.2.11.3 Austria SIC Wafer Polishing Market by Product Type
11.3.2.11.4 Austria SIC Wafer Polishing Market by Application
11.3.2.12 Rest of Western Europe
11.3.2.12.1 Rest of Western Europe SIC Wafer Polishing Market by Process Type
11.3.2.12.2 Rest of Western Europe SIC Wafer Polishing Market by Product Type
11.3.2.12.3 Rest of Western Europe SIC Wafer Polishing Market by Application
11.4 Asia-Pacific
11.4.1 Asia-Pacific SIC Wafer Polishing Market by Country
11.4.2 Asia-Pacific SIC Wafer Polishing Market by Process Type
11.4.3 Asia-Pacific SIC Wafer Polishing Market by Product Type
11.4.4 Asia-Pacific SIC Wafer Polishing Market by Application
11.4.5 China
11.4.5.1 China SIC Wafer Polishing Market by Process Type
11.4.5.2 China SIC Wafer Polishing Market by Application
11.4.5.3 China SIC Wafer Polishing Market by Product Type
11.4.6 India
11.4.6.1 India SIC Wafer Polishing Market by Process Type
11.4.6.2 India SIC Wafer Polishing Market by Product Type
11.4.6.3 India SIC Wafer Polishing Market by Application
11.4.7 Japan
11.4.7.1 Japan SIC Wafer Polishing Market by Process Type
11.4.7.2 Japan SIC Wafer Polishing Market by Product Type
11.4.7.3 Japan SIC Wafer Polishing Market by Application
11.4.8 South Korea
11.4.8.1 South Korea SIC Wafer Polishing Market by Process Type
11.4.8.2 South Korea SIC Wafer Polishing Market by Product Type
11.4.8.3 South Korea SIC Wafer Polishing Market by Application
11.4.9 Vietnam
11.4.9.1 Vietnam SIC Wafer Polishing Market by Process Type
11.4.9.2 Vietnam SIC Wafer Polishing Market by Product Type
11.4.9.3 Vietnam SIC Wafer Polishing Market by Application
11.4.10 Singapore
11.4.10.1 Singapore SIC Wafer Polishing Market by Process Type
11.4.10.2 Singapore SIC Wafer Polishing Market by Product Type
11.4.10.3 Singapore SIC Wafer Polishing Market by Application
11.4.11 Australia
11.4.11.1 Australia SIC Wafer Polishing Market by Process Type
11.4.11.2 Australia SIC Wafer Polishing Market by Product Type
11.4.11.3 Australia SIC Wafer Polishing Market by Application
11.4.12 Rest of Asia-Pacific
11.4.12.1 Rest of Asia-Pacific SIC Wafer Polishing Market by Process Type
11.4.12.2 Rest of Asia-Pacific SIC Wafer Polishing Market by Product Type
11.4.12.3 Rest of Asia-Pacific SIC Wafer Polishing Market by Application
11.5 Middle East & Africa
11.5.1 Middle East
11.5.1.1 Middle East SIC Wafer Polishing Market by Country
11.5.1.2 Middle East SIC Wafer Polishing Market by Process Type
11.5.1.3 Middle East SIC Wafer Polishing Market by Product Type
11.5.1.4 Middle East SIC Wafer Polishing Market by Application
11.5.1.5 UAE
11.5.1.5.1 UAE SIC Wafer Polishing Market by Process Type
11.5.1.5.2 UAE SIC Wafer Polishing Market by Product Type
11.5.1.5.3 UAE SIC Wafer Polishing Market by Application
11.5.1.6 Egypt
11.5.1.6.1 Egypt SIC Wafer Polishing Market by Process Type
11.5.1.6.2 Egypt SIC Wafer Polishing Market by Product Type
11.5.1.6.3 Egypt SIC Wafer Polishing Market by Application
11.5.1.7 Saudi Arabia
11.5.1.7.1 Saudi Arabia SIC Wafer Polishing Market by Process Type
11.5.1.7.2 Saudi Arabia SIC Wafer Polishing Market by Product Type
11.5.1.7.3 Saudi Arabia SIC Wafer Polishing Market by Application
11.5.1.8 Qatar
11.5.1.8.1 Qatar SIC Wafer Polishing Market by Process Type
11.5.1.8.2 Qatar SIC Wafer Polishing Market by Product Type
11.5.1.8.3 Qatar SIC Wafer Polishing Market by Application
11.5.1.9 Rest of Middle East
11.5.1.9.1 Rest of Middle East SIC Wafer Polishing Market by Process Type
11.5.1.9.2 Rest of Middle East SIC Wafer Polishing Market by Product Type
11.5.1.9.3 Rest of Middle East SIC Wafer Polishing Market by Application
11.5.2 Africa
11.5.2.1 Africa Transfusion Diagnostics Market by Country
11.5.2.2 Africa SIC Wafer Polishing Market by Process Type
11.5.2.3 Africa SIC Wafer Polishing Market by Product Type
11.5.2.4 Africa SIC Wafer Polishing Market by Application
11.5.2.5 Nigeria
11.5.2.5.1 Nigeria SIC Wafer Polishing Market by Process Type
11.5.2.5.2 Nigeria SIC Wafer Polishing Market by Product Type
11.5.2.5.3 Nigeria SIC Wafer Polishing Market by Application
11.5.2.6 South Africa
11.5.2.6.1 South Africa SIC Wafer Polishing Market by Process Type
11.5.2.6.2 South Africa SIC Wafer Polishing Market by Product Type
11.5.2.6.3 South Africa SIC Wafer Polishing Market by Application
11.5.2.7 Rest of Africa
11.5.2.7.1 Rest of Africa SIC Wafer Polishing Market by Process Type
11.5.2.7.2 Rest of Africa SIC Wafer Polishing Market by Product Type
11.5.2.7.3 Rest of Africa SIC Wafer Polishing Market by Application
11.6 Latin America
11.6.1 Latin America SIC Wafer Polishing Market by Country
11.6.2 Latin America SIC Wafer Polishing Market by Process Type
11.6.3 Latin America SIC Wafer Polishing Market by Product Type
11.6.4 Latin America SIC Wafer Polishing Market by Application
11.6.5 Brazil
11.6.5.1 Brazil SIC Wafer Polishing Market by Process Type
11.6.5.2 Brazil SIC Wafer Polishing Market by Product Type
11.6.5.3 Brazil SIC Wafer Polishing Market by Application
11.6.6 Argentina
11.6.6.1 Argentina SIC Wafer Polishing Market by Process Type
11.6.6.2 Argentina SIC Wafer Polishing Market by Product Type
11.6.6.3 Argentina SIC Wafer Polishing Market by Application
11.6.7 Colombia
11.6.7.1 Colombia SIC Wafer Polishing Market by Process Type
11.6.7.2 Colombia SIC Wafer Polishing Market by Product Type
11.6.7.3 Colombia SIC Wafer Polishing Market by Application
11.6.8 Rest of Latin America
11.6.8.1 Rest of Latin America SIC Wafer Polishing Market by Process Type
11.6.8.2 Rest of Latin America SIC Wafer Polishing Market by Product Type
11.6.8.3 Rest of Latin America SIC Wafer Polishing Market by Application

12. Company profile
12.1 Kemet International (UK)
12.1.1 Company Overview
12.1.2 Financial
12.1.3 Products/ Services Offered
12.1.4 SWOT Analysis
12.1.5 The SNS View
12.2 Entegris (US)
12.2.1 Company Overview
12.2.2 Financials
12.2.3 Product/Services Offered
12.2.4 SWOT Analysis
12.2.5 The SNS View
12.3 Iljin Diamond (US)
12.3.1 Company Overview
12.3.2 Financials
12.3.3 Product/Services Offered
12.3.4 SWOT Analysis
12.3.5 The SNS View
12.4 Fujimi Corporation (Japan)
12.4.1 Company Overview
12.4.2 Financials
12.4.3 Product/Services Offered
12.4.4 SWOT Analysis
12.4.5 The SNS View
12.5 Saint-Gobain (US)
12.5.1 Company Overview
12.5.2 Financials
12.5.3 Product/Services Offered
12.5.4 SWOT Analysis
12.5.5 The SNS View
12.6 JSR Corporation (Japan)
12.6.1 Company Overview
12.6.2 Financials
12.6.3 Product/Services Offered
12.6.4 SWOT Analysis
12.6.5 The SNS View
12.7 Engis Corporation (US)
12.7.1 Company Overview
12.7.2 Financials
12.7.3 Product/Services Offered
12.7.4 SWOT Analysis
12.7.5 The SNS View
12.8 Ferro Corporation (US)
12.8.1 Company Overview
12.8.2 Financials
12.8.3 Product/Services Offered
12.8.4 SWOT Analysis
12.8.5 The SNS View
12.9 3M (US)
12.9.1 Company Overview
12.9.2 Financials
12.9.3 Product/Services Offered
12.9.4 SWOT Analysis
12.9.5 The SNS View
12.10 SKC (South Korea)
12.10.1 Company Overview
12.10.2 Financials
12.10.3 Product/Services Offered
12.10.4 SWOT Analysis
12.10.5 The SNS View
12.11 DuPont Incorporated (US)
12.11.1 Company Overview
12.11.2 Financials
12.11.3 Product/Services Offered
12.11.4 SWOT Analysis
12.11.5 The SNS View
12.12 Fujifilm Holding America Corporation (US)
12.12.1 Company Overview
12.12.2 Financials
12.12.3 Product/Services Offered
12.12.4 SWOT Analysis
12.12.5 The SNS View

13. Competitive Landscape
13.1 Competitive Bench marking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions

14. Use Case and Best Practices

15. Conclusion

An accurate research report requires proper strategizing as well as implementation. There are multiple factors involved in the completion of good and accurate research report and selecting the best methodology to compete the research is the toughest part. Since the research reports we provide play a crucial role in any company’s decision-making process, therefore we at SNS Insider always believe that we should choose the best method which gives us results closer to reality. This allows us to reach at a stage wherein we can provide our clients best and accurate investment to output ratio.

Each report that we prepare takes a timeframe of 350-400 business hours for production. Starting from the selection of titles through a couple of in-depth brain storming session to the final QC process before uploading our titles on our website we dedicate around 350 working hours. The titles are selected based on their current market cap and the foreseen CAGR and growth.

 

The 5 steps process:

Step 1: Secondary Research:

Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.

Secondary Research

Step 2: Primary Research

When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data.  This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.

We at SNS Insider have divided Primary Research into 2 parts.

Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.

This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.

Primary Research

Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.

Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.

Step 3: Data Bank Validation

Once all the information is collected via primary and secondary sources, we run that information for data validation. At our intelligence centre our research heads track a lot of information related to the market which includes the quarterly reports, the daily stock prices, and other relevant information. Our data bank server gets updated every fortnight and that is how the information which we collected using our primary and secondary information is revalidated in real time.

Data Bank Validation

Step 4: QA/QC Process

After all the data collection and validation our team does a final level of quality check and quality assurance to get rid of any unwanted or undesired mistakes. This might include but not limited to getting rid of the any typos, duplication of numbers or missing of any important information. The people involved in this process include technical content writers, research heads and graphics people. Once this process is completed the title gets uploader on our platform for our clients to read it.

Step 5: Final QC/QA Process:

This is the last process and comes when the client has ordered the study. In this process a final QA/QC is done before the study is emailed to the client. Since we believe in giving our clients a good experience of our research studies, therefore, to make sure that we do not lack at our end in any way humanly possible we do a final round of quality check and then dispatch the study to the client.

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