Electronic Packaging Market Repost Scope & Overview:

Electronic Packaging Market Size was valued at USD 1.01 billion in 2023 and is expected to reach USD 3.82 billion by 2031 and grow at a CAGR of 18.02 % over the forecast period 2024-2031.

Electronic packaging is defined as the design and manufacture of enclosures for electronic devices ranging from single semiconductors to entire systems such as mainframe computers. Mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge are all prevented. Efficient electronic and semiconductor packaging is used to protect consumer electronic products such as smartphones, TVs, tablets, set-top boxes, and digital media adapters from electrostatic discharge, water, harsh weather conditions, corrosion, and dust.

Electronic Packaging Market Revenue Analysis

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It is used in a variety of army and aerospace facilities packed with semiconductor devices such as information handling units, information screen systems, and aircraft control units because it allows for reduced board area, weight, and routing complexity at the PCB level. Electronic packaging includes communication ICs, memory power management devices, analogue, digital, and mixed-signal ICs to drive applications in clinical diagnostics, therapy, and medical imaging, as well as die shrinks in the same package to improve product upgradeability. Integrating electronics expands human interface possibilities, and higher density efficient battery technologies imply that the electronic packaging market share will grow significantly in the forecast years.



  • Consumer electronics are in high demand.

  • The rising popularity of IoT and wireless devices.

  • Growing adoption of smartphones.


  • The initial high cost of electronic packaging and heat dissipation.


  • The expansion of the IoT network market.

  • continuous research and development investments in the market.


  • This will be covered under the final version of the report.


Due to government restrictions imposed in the aftereffects of the COVID-19 pandemic, electronic package manufacturers have been forced to shut down production operations, causing supply chain disruption in the overall semiconductor manufacturing and supply industry. The COVID-19 pandemic has reduced demand for semiconductor-powered products. The lockdown scenario has caused a halt in device production. This has caused disruption in the global electronic packaging market's supply chain. The electronic packaging industry, on the other hand, sees an opportunity in the unprecedented crisis, as organisations begin to work from home and end-users begin to consume more content on digital platforms, increasing the importance of storage and memory solutions for data centres, laptops, and other devices. The market is currently driven by the use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics. Companies that make integrated circuits and semiconductor devices are expected to revise their production plans, sourcing strategies, and industry dynamics to stimulate growth after the shutdown and transportation restrictions are lifted.

Based on type, the electronic packaging market is segmented into Corrugated Boxes, Thermoformed Trays, Blister packs and Clamshell, Paperboard Boxes, Bags and Pouches, and Protective Packaging. Based on material, the electronic packaging market is segmented into Plastic, Glass, Metal, and Others. Based on packaging technology, the electronic packaging market is segmented into Through Hole Mounting, Chip Scale Packages, and Surface Mount Technology. Based on end user, the electronic packaging market is segmented into Consumer Electronics, Automotive, Aerospace & Defense, and Telecommunication.



  • Corrugated Boxes

  • Thermoformed Trays

  • Blister packs and Clamshell

  • Paperboard Boxes

  • Bags and Pouches

  • Protective Packaging


  • Plastic

  • Glass

  • Metal

  • Others


  • Through Hole Mounting

  • Chip Scale Packages

  • Surface Mount Technology


  • Consumer Electronics

  • Automotive

  • Aerospace & Defense

  • Telecommunication


Asia-Pacific dominated the market during the forecast period and is expected to continue to do so during the forecast period due to increased consumer electronics demand across the region. The presence of major semiconductor packaging market players in Asia-Pacific has accelerated the development of electronic packaging technologies and made products more accessible to the market. The countries that comprise the region are China, Japan, India, and the rest of Asia-Pacific. China dominated the market during the forecast period, followed by India. Furthermore, government-backed programs and investments aimed at fostering advanced technology and developing semiconductor packaging solutions contribute to the market's growth.

Electronic Packaging Market By Region

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  • North America

    • USA

    • Canada

    • Mexico

  • Europe

    • Germany

    • UK

    • France

    • Italy

    • Spain

    • The Netherlands

    • Rest of Europe

  • Asia-Pacific

    • Japan

    • south Korea

    • China

    • India

    • Australia

    • Rest of Asia-Pacific

  • The Middle East & Africa

    • Israel

    • UAE

    • South Africa

    • Rest of Middle East & Africa

  • Latin America

    • Brazil

    • Argentina

    • Rest of Latin America


The key players in the electronic packaging market are STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, Sealed Air Corporation & Other Players.

Holst Centre-Company Financial Analysis

Company Landscape Analysis

Electronic Packaging Market Report Scope:
Report Attributes Details
Market Size in 2023 US$ 1.01 Billion
Market Size by 2031 US$ 3.82 Billion
CAGR CAGR of 18.02 % From 2024 to 2031
Base Year 2022
Forecast Period 2024-2031
Historical Data 2020-2021
Report Scope & Coverage Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segments • By Type (Corrugated Boxes, Thermoformed Trays, Blister Packs And Clamshell, Paperboard Boxes, Bags And Pouches, Protective Packaging)
• By Material (Plastic, Glass, Metal, Others)
• By Packaging Technology (Through Hole Mounting, Chip Scale Packages, Surface Mount Technology)
• By End-User (Consumer Electronics, Automotive, Aerospace & Defense, Telecommunication)
Regional Analysis/Coverage North America (USA, Canada, Mexico), Europe
(Germany, UK, France, Italy, Spain, Netherlands,
Rest of Europe), Asia-Pacific (Japan, South Korea,
China, India, Australia, Rest of Asia-Pacific), The
Middle East & Africa (Israel, UAE, South Africa,
Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America)
Company Profiles STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, and Sealed Air Corporation.
Key Drivers • Consumer electronics are in high demand.
• The rising popularity of IoT and wireless devices.
RESTRAINTS • The initial high cost of electronic packaging and heat dissipation.

Frequently Asked Questions

The market value is expected to reach USD 3.82 billion by 2031.

The market has been segmented with respect to type, material, packaging technology and end-user.


Asian pacific region is expected to dominate the IPS Displays Market.

Yes, and they are Raw material vendors, Distributors/traders/wholesalers/suppliers, Regulatory authorities, including government agencies and NGO, Commercial research & development (R&D) institutions, Importers and exporters, Government organizations, research organizations, and consulting firms, Trade/Industrial associations, End-use industries.

Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.

Table of Content:

1. Introduction

1.1 Market Definition

1.2 Scope

1.3 Research Assumptions

2. Research Methodology

3. Market Dynamics

3.1 Drivers

3.2 Restraints

3.3 Opportunities

3.4 Challenges

4. Impact Analysis

4.1 COVID-19 Impact Analysis

4.2 Impact of Ukraine- Russia war

4.3 Impact of ongoing Recession

4.3.1 Introduction

4.3.2 Impact on major economies US Canada Germany France United Kingdom China Japan South Korea Rest of the World

5. Value Chain Analysis


6. Porter’s 5 forces model


7.  PEST Analysis


8. Electronic Packaging Market Segmentation, by type


8.2 Corrugated Boxes

8.3 Thermoformed Trays

8.4 Blister packs and Clamshell

8.5 Paperboard Boxes

8.6 Bags and Pouches

8.7 Protective Packaging

9. Electronic Packaging Market Segmentation, by material


9.2 Plastic

9.3 Glass

9.4 Metal

9.5 Others

10. Electronic Packaging Market Segmentation, by packaging technology

10.1 Introduction

10.2 Through Hole Mounting

10.3 Chip Scale Packages

10.4 Surface Mount Technology

11. Electronic Packaging Market Segmentation, by end user

11.1 Introduction

11.2 Consumer Electronics

11.3 Automotive

11.4 Aerospace & Defense

11.5 Telecommunication

12. Regional Analysis

12.1 Introduction

12.2 North America

12.2.1 USA

12.2.2 Canada

12.2.3 Mexico

12.3 Europe

12.3.1 Germany

12.3.2 UK

12.3.3 France

12.3.4 Italy

12.3.5 Spain

12.3.6 The Netherlands

12.3.7 Rest of Europe

12.4 Asia-Pacific

12.4.1 Japan

12.4.2 South Korea

12.4.3 China

12.4.4 India

12.4.5 Australia

12.4.6 Rest of Asia-Pacific

12.5 The Middle East & Africa

12.5.1 Israel

12.5.2 UAE

12.5.3 South Africa

12.5.4 Rest

12.6 Latin America

12.6.1 Brazil

12.6.2 Argentina

12.6.3 Rest of Latin America

13.Company Profiles

13.1 UFP Technologies

13.1.1 Financial

13.1.2 Products/ Services Offered

13.1.3 SWOT Analysis

13.1.4 The SNS view

13.2 STMicroelectronics

13.3 Excellatron Solid State

13.4 Holst Centre

13.5 Dordan Manufacturing Company


13.7 Canatu

13.8 Front Edge Technology

13.9 Infinite Power Solutions

13.10 Sealed Air Corporation

14.Competitive Landscape

14.1 Competitive Benchmark

14.2 Market Share analysis

14.3 Recent Developments


An accurate research report requires proper strategizing as well as implementation. There are multiple factors involved in the completion of good and accurate research report and selecting the best methodology to compete the research is the toughest part. Since the research reports we provide play a crucial role in any company’s decision-making process, therefore we at SNS Insider always believe that we should choose the best method which gives us results closer to reality. This allows us to reach at a stage wherein we can provide our clients best and accurate investment to output ratio.

Each report that we prepare takes a timeframe of 350-400 business hours for production. Starting from the selection of titles through a couple of in-depth brain storming session to the final QC process before uploading our titles on our website we dedicate around 350 working hours. The titles are selected based on their current market cap and the foreseen CAGR and growth.


The 5 steps process:

Step 1: Secondary Research:

Secondary Research or Desk Research is as the name suggests is a research process wherein, we collect data through the readily available information. In this process we use various paid and unpaid databases which our team has access to and gather data through the same. This includes examining of listed companies’ annual reports, Journals, SEC filling etc. Apart from this our team has access to various associations across the globe across different industries. Lastly, we have exchange relationships with various university as well as individual libraries.

Secondary Research

Step 2: Primary Research

When we talk about primary research, it is a type of study in which the researchers collect relevant data samples directly, rather than relying on previously collected data.  This type of research is focused on gaining content specific facts that can be sued to solve specific problems. Since the collected data is fresh and first hand therefore it makes the study more accurate and genuine.

We at SNS Insider have divided Primary Research into 2 parts.

Part 1 wherein we interview the KOLs of major players as well as the upcoming ones across various geographic regions. This allows us to have their view over the market scenario and acts as an important tool to come closer to the accurate market numbers. As many as 45 paid and unpaid primary interviews are taken from both the demand and supply side of the industry to make sure we land at an accurate judgement and analysis of the market.

This step involves the triangulation of data wherein our team analyses the interview transcripts, online survey responses and observation of on filed participants. The below mentioned chart should give a better understanding of the part 1 of the primary interview.

Primary Research

Part 2: In this part of primary research the data collected via secondary research and the part 1 of the primary research is validated with the interviews from individual consultants and subject matter experts.

Consultants are those set of people who have at least 12 years of experience and expertise within the industry whereas Subject Matter Experts are those with at least 15 years of experience behind their back within the same space. The data with the help of two main processes i.e., FGDs (Focused Group Discussions) and IDs (Individual Discussions). This gives us a 3rd party nonbiased primary view of the market scenario making it a more dependable one while collation of the data pointers.

Step 3: Data Bank Validation

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Data Bank Validation

Step 4: QA/QC Process

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