Electronic Packaging Market Size was valued at USD 1.01 billion in 2023 and is expected to reach USD 3.82 billion by 2031 and grow at a CAGR of 18.02 % over the forecast period 2024-2031.
Electronic packaging is defined as the design and manufacture of enclosures for electronic devices ranging from single semiconductors to entire systems such as mainframe computers. Mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge are all prevented. Efficient electronic and semiconductor packaging is used to protect consumer electronic products such as smartphones, TVs, tablets, set-top boxes, and digital media adapters from electrostatic discharge, water, harsh weather conditions, corrosion, and dust.
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It is used in a variety of army and aerospace facilities packed with semiconductor devices such as information handling units, information screen systems, and aircraft control units because it allows for reduced board area, weight, and routing complexity at the PCB level. Electronic packaging includes communication ICs, memory power management devices, analogue, digital, and mixed-signal ICs to drive applications in clinical diagnostics, therapy, and medical imaging, as well as die shrinks in the same package to improve product upgradeability. Integrating electronics expands human interface possibilities, and higher density efficient battery technologies imply that the electronic packaging market share will grow significantly in the forecast years.
KEY DRIVERS:
Consumer electronics are in high demand.
The rising popularity of IoT and wireless devices.
Growing adoption of smartphones.
RESTRAINTS:
The initial high cost of electronic packaging and heat dissipation.
OPPORTUNITIES:
The expansion of the IoT network market.
continuous research and development investments in the market.
CHALLENGES:
This will be covered under the final version of the report.
Due to government restrictions imposed in the aftereffects of the COVID-19 pandemic, electronic package manufacturers have been forced to shut down production operations, causing supply chain disruption in the overall semiconductor manufacturing and supply industry. The COVID-19 pandemic has reduced demand for semiconductor-powered products. The lockdown scenario has caused a halt in device production. This has caused disruption in the global electronic packaging market's supply chain. The electronic packaging industry, on the other hand, sees an opportunity in the unprecedented crisis, as organisations begin to work from home and end-users begin to consume more content on digital platforms, increasing the importance of storage and memory solutions for data centres, laptops, and other devices. The market is currently driven by the use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics. Companies that make integrated circuits and semiconductor devices are expected to revise their production plans, sourcing strategies, and industry dynamics to stimulate growth after the shutdown and transportation restrictions are lifted.
Based on type, the electronic packaging market is segmented into Corrugated Boxes, Thermoformed Trays, Blister packs and Clamshell, Paperboard Boxes, Bags and Pouches, and Protective Packaging. Based on material, the electronic packaging market is segmented into Plastic, Glass, Metal, and Others. Based on packaging technology, the electronic packaging market is segmented into Through Hole Mounting, Chip Scale Packages, and Surface Mount Technology. Based on end user, the electronic packaging market is segmented into Consumer Electronics, Automotive, Aerospace & Defense, and Telecommunication.
BY TYPE
Corrugated Boxes
Thermoformed Trays
Blister packs and Clamshell
Paperboard Boxes
Bags and Pouches
Protective Packaging
BY MATERIAL
Plastic
Glass
Metal
Others
BY PACKAGING TECHNOLOGY
Through Hole Mounting
Chip Scale Packages
Surface Mount Technology
BY END USER
Consumer Electronics
Automotive
Aerospace & Defense
Telecommunication
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Asia-Pacific dominated the market during the forecast period and is expected to continue to do so during the forecast period due to increased consumer electronics demand across the region. The presence of major semiconductor packaging market players in Asia-Pacific has accelerated the development of electronic packaging technologies and made products more accessible to the market. The countries that comprise the region are China, Japan, India, and the rest of Asia-Pacific. China dominated the market during the forecast period, followed by India. Furthermore, government-backed programs and investments aimed at fostering advanced technology and developing semiconductor packaging solutions contribute to the market's growth.
REGIONAL COVERAGE:
North America
USA
Canada
Mexico
Europe
Germany
UK
France
Italy
Spain
The Netherlands
Rest of Europe
Asia-Pacific
Japan
south Korea
China
India
Australia
Rest of Asia-Pacific
The Middle East & Africa
Israel
UAE
South Africa
Rest of Middle East & Africa
Latin America
Brazil
Argentina
Rest of Latin America
The key players in the electronic packaging market are STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, Sealed Air Corporation & Other Players.
Holst Centre-Company Financial Analysis
| Report Attributes | Details |
|---|---|
| Market Size in 2023 | US$ 1.01 Billion |
| Market Size by 2031 | US$ 3.82 Billion |
| CAGR | CAGR of 18.02 % From 2024 to 2031 |
| Base Year | 2022 |
| Forecast Period | 2024-2031 |
| Historical Data | 2020-2021 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Type (Corrugated Boxes, Thermoformed Trays, Blister Packs And Clamshell, Paperboard Boxes, Bags And Pouches, Protective Packaging) • By Material (Plastic, Glass, Metal, Others) • By Packaging Technology (Through Hole Mounting, Chip Scale Packages, Surface Mount Technology) • By End-User (Consumer Electronics, Automotive, Aerospace & Defense, Telecommunication) |
| Regional Analysis/Coverage | North America (USA, Canada, Mexico), Europe (Germany, UK, France, Italy, Spain, Netherlands, Rest of Europe), Asia-Pacific (Japan, South Korea, China, India, Australia, Rest of Asia-Pacific), The Middle East & Africa (Israel, UAE, South Africa, Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America) |
| Company Profiles | STMicroelectronics, UFP Technologies, Excellatron Solid State, Holst Centre, Dordan Manufacturing Company, AMETEK, Canatu, Front Edge Technology, Infinite Power Solutions, and Sealed Air Corporation. |
| Key Drivers | • Consumer electronics are in high demand. • The rising popularity of IoT and wireless devices. |
| RESTRAINTS | • The initial high cost of electronic packaging and heat dissipation. |
The market value is expected to reach USD 3.82 billion by 2031.
The market has been segmented with respect to type, material, packaging technology and end-user.
Asian pacific region is expected to dominate the IPS Displays Market.
Yes, and they are Raw material vendors, Distributors/traders/wholesalers/suppliers, Regulatory authorities, including government agencies and NGO, Commercial research & development (R&D) institutions, Importers and exporters, Government organizations, research organizations, and consulting firms, Trade/Industrial associations, End-use industries.
Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.
Table of Content:
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 COVID-19 Impact Analysis
4.2 Impact of Ukraine- Russia war
4.3 Impact of ongoing Recession
4.3.1 Introduction
4.3.2 Impact on major economies
4.3.2.1 US
4.3.2.2 Canada
4.3.2.3 Germany
4.3.2.4 France
4.3.2.5 United Kingdom
4.3.2.6 China
4.3.2.7 Japan
4.3.2.8 South Korea
4.3.2.9 Rest of the World
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. Electronic Packaging Market Segmentation, by type
8.1Introduction
8.2 Corrugated Boxes
8.3 Thermoformed Trays
8.4 Blister packs and Clamshell
8.5 Paperboard Boxes
8.6 Bags and Pouches
8.7 Protective Packaging
9. Electronic Packaging Market Segmentation, by material
9.1Introduction
9.2 Plastic
9.3 Glass
9.4 Metal
9.5 Others
10. Electronic Packaging Market Segmentation, by packaging technology
10.1 Introduction
10.2 Through Hole Mounting
10.3 Chip Scale Packages
10.4 Surface Mount Technology
11. Electronic Packaging Market Segmentation, by end user
11.1 Introduction
11.2 Consumer Electronics
11.3 Automotive
11.4 Aerospace & Defense
11.5 Telecommunication
12. Regional Analysis
12.1 Introduction
12.2 North America
12.2.1 USA
12.2.2 Canada
12.2.3 Mexico
12.3 Europe
12.3.1 Germany
12.3.2 UK
12.3.3 France
12.3.4 Italy
12.3.5 Spain
12.3.6 The Netherlands
12.3.7 Rest of Europe
12.4 Asia-Pacific
12.4.1 Japan
12.4.2 South Korea
12.4.3 China
12.4.4 India
12.4.5 Australia
12.4.6 Rest of Asia-Pacific
12.5 The Middle East & Africa
12.5.1 Israel
12.5.2 UAE
12.5.3 South Africa
12.5.4 Rest
12.6 Latin America
12.6.1 Brazil
12.6.2 Argentina
12.6.3 Rest of Latin America
13.Company Profiles
13.1 UFP Technologies
13.1.1 Financial
13.1.2 Products/ Services Offered
13.1.3 SWOT Analysis
13.1.4 The SNS view
13.2 STMicroelectronics
13.3 Excellatron Solid State
13.4 Holst Centre
13.5 Dordan Manufacturing Company
13.6 AMETEK
13.7 Canatu
13.8 Front Edge Technology
13.9 Infinite Power Solutions
13.10 Sealed Air Corporation
14.Competitive Landscape
14.1 Competitive Benchmark
14.2 Market Share analysis
14.3 Recent Developments
15.Conclusion
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