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Semiconductor Bonding Market

Semiconductor Bonding Market Size, Share & Segmentation By Type (Wafer Bonder, Die Bonder, Flip Chip Bonder) By Process Type (Die-To Wafer Bonding, Die-To Die Bonding, Wafer-To-Wafer Bonding) By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology) By Application (Mems And Sensors, LED, RF Devices, Cmos Image Sensors, 3D NAND), By Regions And Global Forecast 2023-2030

Report Id: SNS/SEMI/2203 | July 2022 | Region: Global | 125 Pages

Report Scope & Overview:

The Semiconductor Bonding Market Size was valued at USD 0.91 billion in 2022, and is expected to reach USD 1.22 billion by 2030, and grow at a CAGR of 3.7% over the forecast period 2023-2030.

Atoms are connected in a regular, periodic manner to form semiconductors, such as Silicon (Si), where each atom is surrounded by eight electrons. The electrons that encircle each atom in a semiconductor are connected covalently. Two atoms sharing a pair of electrons make a covalent connection. Each atom forms four covalent bonds with the four other atoms in its immediate vicinity. As a result, each atom and its four surrounding atoms share eight electrons. To create composite 3D structures, cavities, and closed fluid channels that are mechanically strong and able to provide strong electrical contact, semiconductor bonding is employed. It is essential to tightly connect two or more micro-components. The market is expected to experience significant growth due to the growing demand for small electronic devices, the increasing adoption of over-the-counter diets for IoT devices, and the growing demand for electric and hybrid vehicles. The high cost of ownership has hampered market growth. However, the increasing demand for 3D semiconductor integration and packaging and the increasing adoption of IoT and AI in the automotive sector creates an opportunity for semiconductor bonding markets.

Semiconductor Bonding Market Revenue Graph



  • Stacked die technique is becoming more widely used in iot devices.
  • Growing need for small electrical parts.


  • Huge cost of ownership.


  • Increasing use of IoT and AI in the automobile industry.
  • Expanding China's IC industry
  • The need for 3D semiconductor assembly and packaging is growing.


  • Increased complexity brought on by circuit architectures that have been reduced in size.

  • Moving components' mechanical imbalance as well as thin wafers' volatility and susceptibility to pressure or stress damage.


With the increasing spread of COVID-19, there is an increase in the number of health facilities to accommodate the growing number of patients worldwide. This has increased the need for efficient LED lighting technology in health facilities, which is expected to further the need for semiconductor bounding equipment. LED is expected to be part of the fastest growing segment of the semiconductor bond market with a CAGR of 5.5% between 202 and 2028. This segment has seen a low impact compared to other components, due to the growth of LED penetration in a number of sectors, such as consumer electronics, automotive, commercial, residential, and construction. LEDs are widely used in commercial and industrial environments, as LED lighting offers a variety of benefits, including energy efficiency, low heat dissipation, cost efficiency, and nanosecond conversion power. The use of low voltage in LED devices offers a variety of benefits, such as high efficiency and low power consumption. The growing demand for LED components in the healthcare sector has stimulated market growth following the COVID-19 epidemic.

Based on Type, the semiconductor bonding market is segmented into Wafer Bonder, Die Bonder and Flip Chip Bonder.

Based on Process Type, the semiconductor bonding market is segmented into Die-To Wafer Bonding, Die-To Die Bonding and Wafer-To-Wafer Bonding.

Based on Bonding Technology, the semiconductor bonding market is segmented into Die Bonding Technology and Wafer Bonding Technology.

Based on Application, the semiconductor bonding market is segmented into Mems And Sensors, LED, RF Devices, Cmos Image Sensors and 3D NAND.


The key players in the semiconductor bonding market are BE Semiconductor Industries, Kulicke & Soffa, Fuji Corporation, SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Motor Robotics Corporation and Shiaura Mechatronics.


By Type

  • Wafer Bonder

  • Die Bonder

  • Flip Chip Bonder

By Process Type

  • Die-To Wafer Bonding

  • Die-To Die Bonding

  • Wafer-To-Wafer Bonding

By Bonding Technology

  • Die Bonding Technology

  • Wafer Bonding Technology

By Application

  • Mems And Sensors

  • LED

  • RF Devices

  • Cmos Image Sensors

  • 3D NAND

Semiconductor Bonding Market Segment Pie Chart


APAC is expected to register the highest CAGR in the semiconductor bonding market as a whole at the time of forecasting. More than 70% of OSAT players worldwide have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor manufacturing process. The growing number of IDM in the region is expected to boost the growth of the semiconductor bond market in the near future. Similarly, mass production of electronic products such as smartphones, apparel, and white goods in China and Taiwan may also accelerate APAC market growth.


  • North America

    • USA

    • Canada

    • Mexico

  • Europe

    • Germany

    • UK

    • France

    • Italy

    • Spain

    • The Netherlands

    • Rest of Europe

  • Asia-Pacific

    • Japan

    • south Korea

    • China

    • India

    • Australia

    • Rest of Asia-Pacific

  • The Middle East & Africa

    • Israel

    • UAE

    • South Africa

    • Rest of Middle East & Africa

  • Latin America

    • Brazil

    • Argentina

    • Rest of Latin America


Semiconductor Bonding Market Report Scope:
Report Attributes Details
Market Size in 2022 US$ 0.91 Million
Market Size by 2030 US$ 1.22 Billion
CAGR CAGR of 3.7% From 2023 to 2030
Base Year 2022
Forecast Period 2023-2030
Historical Data 2020-2021
Report Scope & Coverage Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segments • By Type (Wafer Bonder, Die Bonder, Flip Chip Bonder)
• By Process Type (Die-To Wafer Bonding, Die-To Die Bonding, Wafer-To-Wafer Bonding)
• By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology)
• By Application (Mems And Sensors, LED, RF Devices, Cmos Image Sensors, 3D NAND)
Regional Analysis/Coverage North America (USA, Canada, Mexico), Europe
(Germany, UK, France, Italy, Spain, Netherlands,
Rest of Europe), Asia-Pacific (Japan, South Korea,
China, India, Australia, Rest of Asia-Pacific), The
Middle East & Africa (Israel, UAE, South Africa,
Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America)
Company Profiles BE Semiconductor Industries, Kulicke & Soffa, Fuji Corporation, SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Motor Robotics Corporation and Shiaura Mechatronics.
Key Drivers • Stacked die technique is becoming more widely used in iot devices.
• Growing need for small electrical parts.
Restraints • Huge cost of ownership.

Frequently Asked Questions (FAQ) :

The Industrial Refrigeration Market size was valued at 880 million in 2021 at a CAGR of 3.7%.

The market value is expected to reach USD 1.1 billion by 2028.

The market has been segmented with respect to type, process type, bonding technology and application.

Top-down research, bottom-up research, qualitative research, quantitative research, and Fundamental research.

Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.

Table of Contents


1. Introduction

1.1 Market Definition

1.2 Scope

1.3 Research Assumptions


2. Research Methodology


3. Market Dynamics

3.1 Drivers

3.2 Restraints

3.3 Opportunities

3.4 Challenges


4. Impact Analysis

4.1 COVID-19 Impact Analysis

4.2 Impact of Ukraine- Russia war

4.3 Impact of ongoing Recession

4.3.1 Introduction

4.3.2 Impact on major economies US Canada Germany France United Kingdom China Japan South Korea Rest of the World


5. Value Chain Analysis


6. Porter’s 5 forces model


7.  PEST Analysis


8. Semiconductor Bonding Market Segmentation, by Type


8.2 Wafer Bonder

8.3 Die Bonder

8.4 Flip Chip Bonder


9. Semiconductor Bonding Market Segmentation, by Type Process


9.2 Die-To Wafer Bonding

9.3 Die-To Die Bonding

9.4 Wafer-To-Wafer Bonding


10. Semiconductor Bonding Market Segmentation, by Technology

10.1 Introduction

10.2 Die Bonding Technology

10.3 Wafer Bonding Technology


11. Semiconductor Bonding Market Segmentation, by Application

11.1 Introduction

11.2 Mems And Sensors

11.3 LED

11.4 RF Devices

11.5 Cmos Image Sensors

11.6 3D NAND


12. Regional Analysis

12.1 Introduction

12.2 North America

12.2.1 USA

12.2.2 Canada

12.2.3 Mexico

12.3 Europe

12.3.1 Germany

12.3.2 UK

12.3.3 France

12.3.4 Italy

12.3.5 Spain

12.3.6 The Netherlands

12.3.7 Rest of Europe

12.4 Asia-Pacific

12.4.1 Japan

12.4.2 South Korea

12.4.3 China

12.4.4 India

12.4.5 Australia

12.4.6 Rest of Asia-Pacific

12.5 The Middle East & Africa

12.5.1 Israel

12.5.2 UAE

12.5.3 South Africa

12.5.4 Rest

12.6 Latin America

12.6.1 Brazil

12.6.2 Argentina

12.6.3 Rest of Latin America


13.Company Profiles

13.1 Panasonic

13.1.1 Financial

13.1.2 Products/ Services Offered

13.1.3 SWOT Analysis

13.1.4 The SNS view

13.2 BE Semiconductor Industries

13.3 Kulicke & Soffa

13.4 Fuji Corporation

13.5 SUSS MicroTech

13.6 ASM Pacific Technology

13.7 Yamaha Motor Robotics Corporation

13.8 Shiaura Mechatronics


14.Competitive Landscape

14.1 Competitive Benchmark

14.2 Market Share analysis

14.3 Recent Developments




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Secondary Research

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