Semiconductor Bonding Market Size, Share & Segmentation By Type (Wafer Bonder, Die Bonder, Flip Chip Bonder) By Process Type (Die-To Wafer Bonding, Die-To Die Bonding, Wafer-To-Wafer Bonding) By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology) By Application (Mems And Sensors, LED, RF Devices, Cmos Image Sensors, 3D NAND), By Regions And Global Forecast 2023-2030
Report Id: SNS/SEMI/2203 | July 2022 | Region: Global | 125 Pages
Report Scope & Overview:
The Semiconductor Bonding Market Size was valued at USD 0.91 billion in 2022, and is expected to reach USD 1.22 billion by 2030, and grow at a CAGR of 3.7% over the forecast period 2023-2030.
Atoms are connected in a regular, periodic manner to form semiconductors, such as Silicon (Si), where each atom is surrounded by eight electrons. The electrons that encircle each atom in a semiconductor are connected covalently. Two atoms sharing a pair of electrons make a covalent connection. Each atom forms four covalent bonds with the four other atoms in its immediate vicinity. As a result, each atom and its four surrounding atoms share eight electrons. To create composite 3D structures, cavities, and closed fluid channels that are mechanically strong and able to provide strong electrical contact, semiconductor bonding is employed. It is essential to tightly connect two or more micro-components. The market is expected to experience significant growth due to the growing demand for small electronic devices, the increasing adoption of over-the-counter diets for IoT devices, and the growing demand for electric and hybrid vehicles. The high cost of ownership has hampered market growth. However, the increasing demand for 3D semiconductor integration and packaging and the increasing adoption of IoT and AI in the automotive sector creates an opportunity for semiconductor bonding markets.
MARKET DYNAMICS:
KEY DRIVERS:
- Stacked die technique is becoming more widely used in iot devices.
- Growing need for small electrical parts.
RESTRAINTS:
- Huge cost of ownership.
OPPORTUNITIES:
- Increasing use of IoT and AI in the automobile industry.
- Expanding China's IC industry
- The need for 3D semiconductor assembly and packaging is growing.
CHALLENGES:
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Increased complexity brought on by circuit architectures that have been reduced in size.
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Moving components' mechanical imbalance as well as thin wafers' volatility and susceptibility to pressure or stress damage.
IMPACT OF COVID-19:
With the increasing spread of COVID-19, there is an increase in the number of health facilities to accommodate the growing number of patients worldwide. This has increased the need for efficient LED lighting technology in health facilities, which is expected to further the need for semiconductor bounding equipment. LED is expected to be part of the fastest growing segment of the semiconductor bond market with a CAGR of 5.5% between 202 and 2028. This segment has seen a low impact compared to other components, due to the growth of LED penetration in a number of sectors, such as consumer electronics, automotive, commercial, residential, and construction. LEDs are widely used in commercial and industrial environments, as LED lighting offers a variety of benefits, including energy efficiency, low heat dissipation, cost efficiency, and nanosecond conversion power. The use of low voltage in LED devices offers a variety of benefits, such as high efficiency and low power consumption. The growing demand for LED components in the healthcare sector has stimulated market growth following the COVID-19 epidemic.
Based on Type, the semiconductor bonding market is segmented into Wafer Bonder, Die Bonder and Flip Chip Bonder.
Based on Process Type, the semiconductor bonding market is segmented into Die-To Wafer Bonding, Die-To Die Bonding and Wafer-To-Wafer Bonding.
Based on Bonding Technology, the semiconductor bonding market is segmented into Die Bonding Technology and Wafer Bonding Technology.
Based on Application, the semiconductor bonding market is segmented into Mems And Sensors, LED, RF Devices, Cmos Image Sensors and 3D NAND.
COMPETITIVE LANDSCAPE:
The key players in the semiconductor bonding market are BE Semiconductor Industries, Kulicke & Soffa, Fuji Corporation, SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Motor Robotics Corporation and Shiaura Mechatronics.
MARKET SEGMENTS:
By Type
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Wafer Bonder
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Die Bonder
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Flip Chip Bonder
By Process Type
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Die-To Wafer Bonding
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Die-To Die Bonding
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Wafer-To-Wafer Bonding
By Bonding Technology
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Die Bonding Technology
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Wafer Bonding Technology
By Application
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Mems And Sensors
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LED
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RF Devices
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Cmos Image Sensors
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3D NAND
REGIONAL ANALYSIS:
APAC is expected to register the highest CAGR in the semiconductor bonding market as a whole at the time of forecasting. More than 70% of OSAT players worldwide have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor manufacturing process. The growing number of IDM in the region is expected to boost the growth of the semiconductor bond market in the near future. Similarly, mass production of electronic products such as smartphones, apparel, and white goods in China and Taiwan may also accelerate APAC market growth.
REGIONAL COVERAGE:
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North America
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USA
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Canada
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Mexico
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Europe
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Germany
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UK
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France
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Italy
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Spain
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The Netherlands
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Rest of Europe
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Asia-Pacific
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Japan
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south Korea
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China
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India
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Australia
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Rest of Asia-Pacific
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The Middle East & Africa
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Israel
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UAE
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South Africa
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Rest of Middle East & Africa
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Latin America
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Brazil
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Argentina
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Rest of Latin America
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| Report Attributes | Details |
|---|---|
| Market Size in 2022 | US$ 0.91 Million |
| Market Size by 2030 | US$ 1.22 Billion |
| CAGR | CAGR of 3.7% From 2023 to 2030 |
| Base Year | 2022 |
| Forecast Period | 2023-2030 |
| Historical Data | 2020-2021 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • By Type (Wafer Bonder, Die Bonder, Flip Chip Bonder) • By Process Type (Die-To Wafer Bonding, Die-To Die Bonding, Wafer-To-Wafer Bonding) • By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology) • By Application (Mems And Sensors, LED, RF Devices, Cmos Image Sensors, 3D NAND) |
| Regional Analysis/Coverage | North America (USA, Canada, Mexico), Europe (Germany, UK, France, Italy, Spain, Netherlands, Rest of Europe), Asia-Pacific (Japan, South Korea, China, India, Australia, Rest of Asia-Pacific), The Middle East & Africa (Israel, UAE, South Africa, Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America) |
| Company Profiles | BE Semiconductor Industries, Kulicke & Soffa, Fuji Corporation, SUSS MicroTech, ASM Pacific Technology, Panasonic, Yamaha Motor Robotics Corporation and Shiaura Mechatronics. |
| Key Drivers | • Stacked die technique is becoming more widely used in iot devices. • Growing need for small electrical parts. |
| Restraints | • Huge cost of ownership. |
Frequently Asked Questions (FAQ) :
What is the worth of the Semiconductor Bonding Market?
The Industrial Refrigeration Market size was valued at 880 million in 2021 at a CAGR of 3.7%.
What will be the market value of the Semiconductor Bonding Market?
The market value is expected to reach USD 1.1 billion by 2028.
What are the top market segments that have been covered in this report?
The market has been segmented with respect to type, process type, bonding technology and application.
Which research methodology are used in this report?
Top-down research, bottom-up research, qualitative research, quantitative research, and Fundamental research.
Who can buy this report?
Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.
Table of Contents
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 COVID-19 Impact Analysis
4.2 Impact of Ukraine- Russia war
4.3 Impact of ongoing Recession
4.3.1 Introduction
4.3.2 Impact on major economies
4.3.2.1 US
4.3.2.2 Canada
4.3.2.3 Germany
4.3.2.4 France
4.3.2.5 United Kingdom
4.3.2.6 China
4.3.2.7 Japan
4.3.2.8 South Korea
4.3.2.9 Rest of the World
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. Semiconductor Bonding Market Segmentation, by Type
8.1Introduction
8.2 Wafer Bonder
8.3 Die Bonder
8.4 Flip Chip Bonder
9. Semiconductor Bonding Market Segmentation, by Type Process
9.1Introduction
9.2 Die-To Wafer Bonding
9.3 Die-To Die Bonding
9.4 Wafer-To-Wafer Bonding
10. Semiconductor Bonding Market Segmentation, by Technology
10.1 Introduction
10.2 Die Bonding Technology
10.3 Wafer Bonding Technology
11. Semiconductor Bonding Market Segmentation, by Application
11.1 Introduction
11.2 Mems And Sensors
11.3 LED
11.4 RF Devices
11.5 Cmos Image Sensors
11.6 3D NAND
12. Regional Analysis
12.1 Introduction
12.2 North America
12.2.1 USA
12.2.2 Canada
12.2.3 Mexico
12.3 Europe
12.3.1 Germany
12.3.2 UK
12.3.3 France
12.3.4 Italy
12.3.5 Spain
12.3.6 The Netherlands
12.3.7 Rest of Europe
12.4 Asia-Pacific
12.4.1 Japan
12.4.2 South Korea
12.4.3 China
12.4.4 India
12.4.5 Australia
12.4.6 Rest of Asia-Pacific
12.5 The Middle East & Africa
12.5.1 Israel
12.5.2 UAE
12.5.3 South Africa
12.5.4 Rest
12.6 Latin America
12.6.1 Brazil
12.6.2 Argentina
12.6.3 Rest of Latin America
13.Company Profiles
13.1 Panasonic
13.1.1 Financial
13.1.2 Products/ Services Offered
13.1.3 SWOT Analysis
13.1.4 The SNS view
13.2 BE Semiconductor Industries
13.3 Kulicke & Soffa
13.4 Fuji Corporation
13.5 SUSS MicroTech
13.6 ASM Pacific Technology
13.7 Yamaha Motor Robotics Corporation
13.8 Shiaura Mechatronics
14.Competitive Landscape
14.1 Competitive Benchmark
14.2 Market Share analysis
14.3 Recent Developments
15.Conclusion
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