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Bonding Sheet Market

Bonding Sheet Market Size, Share and Segmentation by adhesive material (Polyesters (PET), Polyimides (PI), Acrylics, Modified Epoxies, Others), by adhesive thickness (12µM (0.5MIL), 25µM (1MIL), 50µM (2MIL), 75µM (3MIL), 100µM (4MIL)), by application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction, Others), by Regions and Global Market Forecast 2022-2028

Report Id: SNS/C&M/2554 | July 2022 | Region: Global | 129 Pages

Report Scope & Overview:

Bonding Sheet Market Size was esteemed at USD 374 million out of 2021 and is supposed to arrive at USD 649.3 million by 2028, and develop at a CAGR of 8.2% over the forecast period 2022-2028.

A Bonding sheet is a sheet or film containing a cement layer on one side that is utilized for surface covering or Bonding. It accompanies a separable paper discharge layer to keep away from the early grip. It is generally smooth and reflexive, albeit finished varieties are now and then accessible. Unadulterated cement, sheet glue, and simply glue are different names for it. In multi-facet covers, a Bonding sheet is by and large used to tie adaptable internal layers or firm cap layers. It is regularly utilized to bond adaptable circuits to unbending flex sheets, during the development of intensity sinks, inflexible flex PCBs, bond stiffeners, and others. Other than that, it is utilized for fancy overlays.

Bonding Sheet Market Revenue Graph

Each country in the globe went into lockdown during the COVID-19 pandemic, which altogether affected the worldwide modern industry. The worldwide lockdowns made assembling line interferences due the labor supply deficiencies and latent planned operations. The Bonding sheet market has endured because of assembling and store network interferences.

Bonding sheets are essentially utilized for Bonding adaptable internal layers or unbending cap layers in multi-facet cover, for Bonding adaptable circuits and unbending sheets, as well as Bonding stiffeners and intensity sinks. Glues assume a pivotal part in Bonding the various components in electronic parts. The utilization of the kind of cement is subject to variables like the Bonding region, working temperature, compound openness, and period of usability of the part. Progressing mechanical advancements in hardware and semiconductors to work with the scaling down of electronic parts empowers reduced endlessly plan opportunity. These mechanical improvements in the gadgets area are empowered through the supplanting of bound joints with the utilization of cutting-edge cement. The gadgets market incorporates different industry verticals like PCs and servers, interchanges, purchaser products, modern, clinical, and cars. Differed electronic items need a Bonding sheet.

Impact of Covid-19:

During the COVID-19 pandemic, each country on the planet entered a few types of lockdowns and this significantly affects the world's assembling industry. The disturbances in the creation and store network adversely affect the Bonding sheet market. The Bonding sheet market is fundamentally packed in Asian nations, with China, South Korea, and Japan driving the market concerning production volume. Considering that these nations became infection areas of interest in the early episode of the COVID-19 pandemic, the majority of their assembling center points stayed under lockdowns to confine the spread of the infection. The COVID-19 pandemic spread to the Japanese central area through China, with the capital city of Tokyo turning into the focal point of the infection. Accordingly, Tokyo, alongside five different prefectures of the nation were fixed to contain the spread of the infection. As a flowing impact of Chinese production lines being constrained into lockdown, there were store network disturbances in Japanese assembling businesses, with commodities to the nation diminishing by practically half in 2020. The pandemic has not just caused creation line disturbances and store network slows down yet in addition work deficiencies and idle planned operations attributable to mass lockdowns by nations across the world.

Market Estimations:

By adhesive material:

In light of the sticky material, the polyimides section represented the biggest piece of the pie. This development is credited to their predominant warm and mechanical properties in contrast with different polymers. Expanded requests from the gadgets business combined with areas of strength for with from the developing auto industry is supposed to fuel the development of this sticky material during the conjecture time frame.

By adhesive thickness:

The rising creation of multi-facet FPCs is driving the interest for Bonding sheets for the grip of adaptable circuits to unbending sheets, inflexible flex circuits, stiffeners, and different materials. Driving makers, for example, DuPont is creating an acrylic-based 12 µM Bonding sheet under the brand, Pyralux FR Sheet Adhesive essentially for FPC applications. It offers the capacity to endure various cover cycles and gives better Bonding strength than electronic applications. Toray Industries, Inc. likewise offers polyimide-/epoxy-based Bonding sheets for media transmission, car, and electronic applications.

By application:

Bonding sheets give moment bonds attributable to their even glue inclusion qualities on different surfaces. They are ideal materials for inflexible substrates, interlayer protecting materials for FPCs, and plating and laser handling. Attachment by Bonding sheet isn't affected in hot and moist conditions and gives the improved appearance. Nonetheless, capacity in spotless and dry conditions is fitting. Bonding sheet has different properties, for example, dielectric contact, warm opposition, hostility to movement, and others. They are produced for requesting applications in gadgets, for example, fixing CPUs to warm sinks or intensity radiation fans, multi-facet FPCs, LED modules, hard circle drives, scaled-down electronic parts, for example, Bonding chips and base cards of little memory cards, and others. Altered epoxies, acrylics, and polyimide glues are utilized to foster Bonding sheets for gadgets/optoelectronics applications.

Market Segmentation:

By adhesive material:

  • Polyesters (PET)

  • Polyimides (PI)

  • Acrylics

  • Modified Epoxies

  • Others

By adhesive thickness:

  • 12µM (0.5MIL)

  • 25µM (1MIL)

  • 50µM (2MIL)

  • 75µM (3MIL)

  • 100µM (4MIL)

By application:

  • Electronics/Optoelectronics

  • Telecommunication/5G Communication

  • Automotive

  • Building & Construction

  • Others

Bonding Sheet Market Segment Pie Chart

Regional Analysis:

  • North America

    • The USA

    • Canada

    • Mexico

  • Europe

    • Germany

    • The UK

    • France

    • Italy

    • Spain

    • The Netherlands

    • Rest of Europe

  • Asia-Pacific

    • Japan

    • south Korea

    • China

    • India

    • Australia

    • Rest of Asia-Pacific

  • The Middle East & Africa

    • Israel

    • UAE

    • South Africa

    • Rest of Middle East & Africa

  • Latin America

    • Brazil

    • Argentina

    • Rest of Latin America

APAC is the biggest and quickest developing locale for the bonding sheet market. The development sought after for bonding sheet in the locale can be generally credited to elements like high populace, expanding modern development, and rigid ecological standards. Besides, the rising number of uses in the area is additionally prompting advancements and improvements in the field of bonding sheets, in this way energizing the development of the APAC bonding sheet market.

Key Players:

Arisawa Manufacturing Co., DuPont, NIKKAN INDUSTRIES Co., Ltd., Dexerials Corporation, Nitto Denko Corporation, Showa Denko Materials Co., Ltd., Toray Industries, Inc., NAMICS Corporation, and Shin-Etsu Polymer Co., Ltd.

 

Bonding Sheet Market Report Scope:
Report Attributes Details
Market Size in 2021 US$ 374 Million
Market Size by 2028 US$ 649.3 Million
CAGR CAGR of 8.2% From 2022 to 2028
Base Year 2021
Forecast Period 2022-2028
Historical Data 2017-2020
Report Scope & Coverage Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segments • by adhesive material (Polyesters (PET), Polyimides (PI), Acrylics, Modified Epoxies, Others)
• by adhesive thickness (12µM (0.5MIL), 25µM (1MIL), 50µM (2MIL), 75µM (3MIL), 100µM (4MIL))
• by application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction, Others)
Regional Analysis/Coverage North America (USA, Canada, Mexico), Europe
(Germany, UK, France, Italy, Spain, Netherlands,
Rest of Europe), Asia-Pacific (Japan, South Korea,
China, India, Australia, Rest of Asia-Pacific), The
Middle East & Africa (Israel, UAE, South Africa,
Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America)
Company Profiles Arisawa Manufacturing Co., DuPont, NIKKAN INDUSTRIES Co., Ltd., Dexerials Corporation, Nitto Denko Corporation, Showa Denko Materials Co., Ltd., Toray Industries, Inc., NAMICS Corporation, and Shin-Etsu Polymer Co., Ltd.


Frequently Asked Questions (FAQ) :


Table of Contents

 

1. Introduction

1.1 Market Definition

1.2 Scope

1.3 Research Assumptions

 

2. Research Methodology

 

3. Market Dynamics

3.1 Drivers          

3.2 Restraints

3.3 Opportunities

3.4 Challenges

 

4. Impact Analysis

4.1 Covid 19 Impact Analysis

4.2 Impact of the Ukraine and Russia war

 

5. Value chain analysis

 

6. Porter’s 5 forces model

 

7. PEST analysis

 

8. Global Bonding Sheet Market segmentation, By adhesive material

8.1 Polyesters (PET)

8.2 Polyimides (PI)

8.3 Acrylics

8.4 Modified Epoxies

8.5 Others

 

9. Global Bonding Sheet Market segmentation, By adhesive thickness

9.1 12µM (0.5MIL)

9.2 25µM (1MIL)

9.3 50µM (2MIL)

9.4 75µM (3MIL)

9.5 100µM (4MIL)

 

10. Global Bonding Sheet Market segmentation, By application

10.1 Electronics/Optoelectronics

10.2 Telecommunication/5G Communication

10.3 Automotive

10.4 Building & Construction

10.5 Others

 

11. Global Bonding Sheet Market, by region/ country

11.1 Introduction

11.2 North America

11.2.1 USA

11.2.2 Canada

11.2.3 Mexico

11.3 Europe

11.3.1 Germany

11.3.2 UK

11.3.3 France

11.3.4 Italy

11.3.5 Spain

11.3.6 The Netherlands

11.3.7 Rest of Europe

11.4 Asia-Pacific

11.4.1 Japan

11.4.2 South Korea

11.4.3 China

11.4.4 India

11.4.5 Australia

11.4.6 Rest of Asia-Pacific

11.5 The Middle East & Africa

11.5.1 Israel

11.5.2 UAE

11.5.3 South Africa

11.5.4 Rest

11.6 Latin America

11.6.1 Brazil

11.6.2 Argentina

11.6.3 Rest of Latin America

 

12. Company profiles

12.1 Arisawa Manufacturing Co.

12.1.1 Financial

12.1.2 Products/ Services Offered

12.1.3 Swot Analysis

12.1.4 The SNS View

12.2 DuPont

12.3 NIKKAN INDUSTRIES Co., Ltd.

12.4 Dexerials Corporation

12.5 Nitto Denko Corporation

12.6 Showa Denko Materials Co., Ltd.

12.7 Toray Industries, Inc.

12.8 NAMICS Corporation

12.9 Shin-Etsu Polymer Co., Ltd.

 

13. Competitive Landscape

13.1 Competitive Bench Marking

13.2 Market Share Analysis

13.3 Recent Developments

 

14. Conclusion

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Step 1: Secondary Research:

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Secondary Research

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