Bonding Sheet Market Size, Share and Segmentation by adhesive material (Polyesters (PET), Polyimides (PI), Acrylics, Modified Epoxies, Others), by adhesive thickness (12µM (0.5MIL), 25µM (1MIL), 50µM (2MIL), 75µM (3MIL), 100µM (4MIL)), by application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction, Others), by Regions and Global Market Forecast 2023-2030
Report Id: SNS/C&M/2554 | July 2022 | Region: Global | 129 Pages
Report Scope & Overview:
Bonding Sheet Market Size was esteemed at USD 404.46 million out of 2022 and is supposed to arrive at USD 760.18 million by 2030, and develop at a CAGR of 8.2% over the forecast period 2023-2030.
A Bonding sheet is a sheet or film containing a cement layer on one side that is utilized for surface covering or Bonding. It accompanies a separable paper discharge layer to keep away from the early grip. It is generally smooth and reflexive, albeit finished varieties are now and then accessible. Unadulterated cement, sheet glue, and simply glue are different names for it. In multi-facet covers, a Bonding sheet is by and large used to tie adaptable internal layers or firm cap layers. It is regularly utilized to bond adaptable circuits to unbending flex sheets, during the development of intensity sinks, inflexible flex PCBs, bond stiffeners, and others. Other than that, it is utilized for fancy overlays.
Each country in the globe went into lockdown during the COVID-19 pandemic, which altogether affected the worldwide modern industry. The worldwide lockdowns made assembling line interferences due the labor supply deficiencies and latent planned operations. The Bonding sheet market has endured because of assembling and store network interferences.
Bonding sheets are essentially utilized for Bonding adaptable internal layers or unbending cap layers in multi-facet cover, for Bonding adaptable circuits and unbending sheets, as well as Bonding stiffeners and intensity sinks. Glues assume a pivotal part in Bonding the various components in electronic parts. The utilization of the kind of cement is subject to variables like the Bonding region, working temperature, compound openness, and period of usability of the part. Progressing mechanical advancements in hardware and semiconductors to work with the scaling down of electronic parts empowers reduced endlessly plan opportunity. These mechanical improvements in the gadgets area are empowered through the supplanting of bound joints with the utilization of cutting-edge cement. The gadgets market incorporates different industry verticals like PCs and servers, interchanges, purchaser products, modern, clinical, and cars. Differed electronic items need a Bonding sheet.
Impact of Covid-19:
During the COVID-19 pandemic, each country on the planet entered a few types of lockdowns and this significantly affects the world's assembling industry. The disturbances in the creation and store network adversely affect the Bonding sheet market. The Bonding sheet market is fundamentally packed in Asian nations, with China, South Korea, and Japan driving the market concerning production volume. Considering that these nations became infection areas of interest in the early episode of the COVID-19 pandemic, the majority of their assembling center points stayed under lockdowns to confine the spread of the infection. The COVID-19 pandemic spread to the Japanese central area through China, with the capital city of Tokyo turning into the focal point of the infection. Accordingly, Tokyo, alongside five different prefectures of the nation were fixed to contain the spread of the infection. As a flowing impact of Chinese production lines being constrained into lockdown, there were store network disturbances in Japanese assembling businesses, with commodities to the nation diminishing by practically half in 2020. The pandemic has not just caused creation line disturbances and store network slows down yet in addition work deficiencies and idle planned operations attributable to mass lockdowns by nations across the world.
Market Estimations:
By adhesive material:
In light of the sticky material, the polyimides section represented the biggest piece of the pie. This development is credited to their predominant warm and mechanical properties in contrast with different polymers. Expanded requests from the gadgets business combined with areas of strength for with from the developing auto industry is supposed to fuel the development of this sticky material during the conjecture time frame.
By adhesive thickness:
The rising creation of multi-facet FPCs is driving the interest for Bonding sheets for the grip of adaptable circuits to unbending sheets, inflexible flex circuits, stiffeners, and different materials. Driving makers, for example, DuPont is creating an acrylic-based 12 µM Bonding sheet under the brand, Pyralux FR Sheet Adhesive essentially for FPC applications. It offers the capacity to endure various cover cycles and gives better Bonding strength than electronic applications. Toray Industries, Inc. likewise offers polyimide-/epoxy-based Bonding sheets for media transmission, car, and electronic applications.
By application:
Bonding sheets give moment bonds attributable to their even glue inclusion qualities on different surfaces. They are ideal materials for inflexible substrates, interlayer protecting materials for FPCs, and plating and laser handling. Attachment by Bonding sheet isn't affected in hot and moist conditions and gives the improved appearance. Nonetheless, capacity in spotless and dry conditions is fitting. Bonding sheet has different properties, for example, dielectric contact, warm opposition, hostility to movement, and others. They are produced for requesting applications in gadgets, for example, fixing CPUs to warm sinks or intensity radiation fans, multi-facet FPCs, LED modules, hard circle drives, scaled-down electronic parts, for example, Bonding chips and base cards of little memory cards, and others. Altered epoxies, acrylics, and polyimide glues are utilized to foster Bonding sheets for gadgets/optoelectronics applications.
Market Segmentation:
By adhesive material:
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Polyesters (PET)
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Polyimides (PI)
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Acrylics
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Modified Epoxies
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Others
By adhesive thickness:
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12µM (0.5MIL)
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25µM (1MIL)
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50µM (2MIL)
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75µM (3MIL)
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100µM (4MIL)
By application:
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Electronics/Optoelectronics
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Telecommunication/5G Communication
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Automotive
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Building & Construction
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Others
Regional Analysis:
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North America
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The USA
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Canada
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Mexico
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Europe
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Germany
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The UK
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France
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Italy
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Spain
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The Netherlands
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Rest of Europe
-
-
Asia-Pacific
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Japan
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south Korea
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China
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India
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Australia
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Rest of Asia-Pacific
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The Middle East & Africa
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Israel
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UAE
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South Africa
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Rest of Middle East & Africa
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Latin America
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Brazil
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Argentina
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Rest of Latin America
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APAC is the biggest and quickest developing locale for the bonding sheet market. The development sought after for bonding sheet in the locale can be generally credited to elements like high populace, expanding modern development, and rigid ecological standards. Besides, the rising number of uses in the area is additionally prompting advancements and improvements in the field of bonding sheets, in this way energizing the development of the APAC bonding sheet market.
Key Players:
Arisawa Manufacturing Co., DuPont, NIKKAN INDUSTRIES Co., Ltd., Dexerials Corporation, Nitto Denko Corporation, Showa Denko Materials Co., Ltd., Toray Industries, Inc., NAMICS Corporation, and Shin-Etsu Polymer Co., Ltd.
| Report Attributes | Details |
|---|---|
| Market Size in 2022 | US$ 404.46 Million |
| Market Size by 2030 | US$ 760.18 Million |
| CAGR | CAGR of 8.2% From 2023 to 2030 |
| Base Year | 2022 |
| Forecast Period | 2023-2030 |
| Historical Data | 2020-2021 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • by adhesive material (Polyesters (PET), Polyimides (PI), Acrylics, Modified Epoxies, Others) • by adhesive thickness (12µM (0.5MIL), 25µM (1MIL), 50µM (2MIL), 75µM (3MIL), 100µM (4MIL)) • by application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction, Others) |
| Regional Analysis/Coverage | North America (USA, Canada, Mexico), Europe (Germany, UK, France, Italy, Spain, Netherlands, Rest of Europe), Asia-Pacific (Japan, South Korea, China, India, Australia, Rest of Asia-Pacific), The Middle East & Africa (Israel, UAE, South Africa, Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America) |
| Company Profiles | Arisawa Manufacturing Co., DuPont, NIKKAN INDUSTRIES Co., Ltd., Dexerials Corporation, Nitto Denko Corporation, Showa Denko Materials Co., Ltd., Toray Industries, Inc., NAMICS Corporation, and Shin-Etsu Polymer Co., Ltd. |
Frequently Asked Questions (FAQ) :
Table of Contents
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 COVID-19 Impact Analysis
4.2 Impact of Ukraine- Russia war
4.3 Impact of ongoing Recession
4.3.1 Introduction
4.3.2 Impact on major economies
4.3.2.1 US
4.3.2.2 Canada
4.3.2.3 Germany
4.3.2.4 France
4.3.2.5 United Kingdom
4.3.2.6 China
4.3.2.7 Japan
4.3.2.8 South Korea
4.3.2.9 Rest of the World
5. Value chain analysis
6. Porter’s 5 forces model
7. PEST analysis
8. Global Bonding Sheet Market segmentation, By adhesive material
8.1 Polyesters (PET)
8.2 Polyimides (PI)
8.3 Acrylics
8.4 Modified Epoxies
8.5 Others
9. Global Bonding Sheet Market segmentation, By adhesive thickness
9.1 12µM (0.5MIL)
9.2 25µM (1MIL)
9.3 50µM (2MIL)
9.4 75µM (3MIL)
9.5 100µM (4MIL)
10. Global Bonding Sheet Market segmentation, By application
10.1 Electronics/Optoelectronics
10.2 Telecommunication/5G Communication
10.3 Automotive
10.4 Building & Construction
10.5 Others
11. Global Bonding Sheet Market, by region/ country
11.1 Introduction
11.2 North America
11.2.1 USA
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Germany
11.3.2 UK
11.3.3 France
11.3.4 Italy
11.3.5 Spain
11.3.6 The Netherlands
11.3.7 Rest of Europe
11.4 Asia-Pacific
11.4.1 Japan
11.4.2 South Korea
11.4.3 China
11.4.4 India
11.4.5 Australia
11.4.6 Rest of Asia-Pacific
11.5 The Middle East & Africa
11.5.1 Israel
11.5.2 UAE
11.5.3 South Africa
11.5.4 Rest
11.6 Latin America
11.6.1 Brazil
11.6.2 Argentina
11.6.3 Rest of Latin America
12. Company profiles
12.1 Arisawa Manufacturing Co.
12.1.1 Financial
12.1.2 Products/ Services Offered
12.1.3 Swot Analysis
12.1.4 The SNS View
12.2 DuPont
12.3 NIKKAN INDUSTRIES Co., Ltd.
12.4 Dexerials Corporation
12.5 Nitto Denko Corporation
12.6 Showa Denko Materials Co., Ltd.
12.7 Toray Industries, Inc.
12.8 NAMICS Corporation
12.9 Shin-Etsu Polymer Co., Ltd.
13. Competitive Landscape
13.1 Competitive Bench Marking
13.2 Market Share Analysis
13.3 Recent Developments
14. Conclusion
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