DRAM Module and Component Market Size, Share & Segmentation by type (DDR2, DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, LPDRAM, GDDR, HBM, Others) by memory (Up to 1GB, 2GB, 3-4GB, 6-8GB, >8GB) by End-User Industry (Consumer Electronics, Mobile Devices, Servers, Computers, Automobiles, Others), by Regions and Global Forecast 2023-2030
Report Id: SNS/SEMI/1602 | June 2022 | Region: Global | 125 Pages
Report Scope & Overview:
DRAM Module and Component Market Size was valued at USD 97.24 billion in 2022 and is expected to reach USD 108.68 billion by 2030, and grow at a CAGR of 1.4% over the forecast period 2023-2030.
DRAM modules for random access memory (DRAM) flexible memory (DRAM) chips connected to circuit boards DRAM chips are dynamic memory cells of a single transistor that use capacitors to store each component in an adjustable row and column format. It is a type of Random Access Memory (RAM) that requires a capacitor to be constantly charged or updated for data storage. The DRAM module is a powerful memory device; requires power supply to maintain its data. In this way, DRAM modules use flexible memory. Different types of DRAM modules can be selected for their specific features. Examples include synchronous DRAM (SDRAM) modules, extended data modules (EDO), and fast page module (FPM) modules.
MARKET DYNAMICS:
KEY DRIVERS:
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The advent of 5G technology.
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Increasing Demand for DRAM modules and components.
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Increased use of high-end smartphones
RESTRAINTS:
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Instability in extreme environmental conditions.
OPPORTUNITIES:
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Use of Internet of Things (IoT) devices has increased.
CHALLENGES:
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Pricing is extremely volatile.
IMPACT OF COVID-19:
COVID-19 has had a severe impact on the global economy as well as all industries. To stop the plague from spreading, governments in several countries have established borders. The initial phase of the epidemic's global shutdown in many countries has had a significant influence on people's lives and quality of life. As a result, the global supply chain has been shattered. The global economy has shrunk as commodity demand has decreased considerably. Due to the outbreak, which has caused a lack of immature materials, production in all industries has been slowed. Productivity declines are caused by variables such as depreciation and supply chain disruption.
Outbreak of COVID-19 has had a devastating effect on the supply of mobile devices, computers, and consumer electronics, which are the leading industries of end users of the DRAM module and component market. The closure and suspension of manufacturing operations also hampered economic growth and boosted the global semiconductor industry and created severe shortages of chips, affecting cars, computers, and other industries around the world. However, with this shortage comes the opportunity for investment and the emergence of new players in the semiconductor industry; semiconductor manufacturers are now busy expanding the product.
COMPETITIVE LANDSCAPE:
The key market players in Global DRAM Module and Component Market are Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation, SK Hynix Inc, Nanya Technology Corporation, Powerchip Technology, Ramaxel Technology, SMART Modular Technologies and Other.
MARKET SEGMENTATION:
BY TYPE
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DDR2 DRAM
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DDR3 DRAM
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DDR4 DRAM
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DDR5 DRAM
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LPDRAM
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GDDR
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HBM
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Others
BY MEMORY
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Up to 1GB
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2GB
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3-4GB
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6-8GB
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8GB
BY END-USER INDUSTRY
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Consumer Electronics
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Mobile Devices
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Servers
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Computers
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Automobiles
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Others
REGIONAL ANALYSIS:
APAC holds the largest market share of the DRAM module and Components market and is expected to maintain its position as the largest during the forecast period due to the presence of countries such as China and South Korea in the region. China is a major market for memory devices and continues to grow significantly due to its huge demand in the mobile, automotive, and server markets, but it depends on other countries to meet its DRAM requirements. With the launch of "Made in China 2025" in 2015, the Chinese government, in partnership with private actors, began investing billions of dollars in developing their semiconductor industry with the aim of closing the gap between domestic production and consumption. South Korea, on the other hand, is a leader in the production of mobile devices, servers, consumer electronics, computers, and the DRAM module and components for corporate presence.
REGIONAL COVERAGE:
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North America
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USA
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Canada
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Mexico
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Europe
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Germany
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UK
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France
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Italy
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Spain
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The Netherlands
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Rest of Europe
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Asia-Pacific
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Japan
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South Korea
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China
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India
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Australia
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Rest of Asia-Pacific
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The Middle East & Africa
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Israel
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UAE
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South Africa
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Rest of Middle East & Africa
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Latin America
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Brazil
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Argentina
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Rest of Latin America
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| Report Attributes | Details |
|---|---|
| Market Size in 2022 | US$ 97.24 Billion |
| Market Size by 2030 | US$ 108.68 Billion |
| CAGR | CAGR of 1.4% From 2023 to 2030 |
| Base Year | 2022 |
| Forecast Period | 2023-2030 |
| Historical Data | 2020-2021 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segments | • by type (DDR2, DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, LPDRAM, GDDR, HBM, Others) • by memory (Up to 1GB, 2GB, 3-4GB, 6-8GB, >8GB) • by End-User Industry (Consumer Electronics, Mobile Devices, Servers, Computers, Automobiles, Others) |
| Regional Analysis/Coverage | North America (USA, Canada, Mexico), Europe (Germany, UK, France, Italy, Spain, Netherlands, Rest of Europe), Asia-Pacific (Japan, South Korea, China, India, Australia, Rest of Asia-Pacific), The Middle East & Africa (Israel, UAE, South Africa, Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America) |
| Company Profiles | Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation |
| Key Drivers | • The advent of 5G technology. • Increasing Demand for DRAM modules and components |
| Restraints | • Instability in extreme environmental conditions. |
Frequently Asked Questions (FAQ) :
What is the worth of the DRAM Module and Component Market?
The DRAM Module and Component Market size was valued at 95.9 billion in 2021 at a CAGR of 1.4%.
which region is the greatest market In the DRAM Module and Component Market report?
APAC is the greatest DRAM module and Components market and is expected to maintain its position as the largest during the forecast period due to the presence of countries such as China and South Korea in the region.
In the DRAM Module and Component Market, who are the major key players?
The key market players in Global DRAM Module and Component Market are Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation, SK Hynix Inc, Nanya Technology Corporation, Powerchip Technology, Ramaxel Technology, SMART Modular Technologies and Other.
Does this report cover key stakeholders?
Yes, and they are Raw material vendors, Distributors/traders/wholesalers/suppliers, Regulatory authorities, including government agencies and NGO, Commercial research & development (R&D) institutions, Importers and exporters, Government organizations, research organizations, and consulting firms, Trade/Industrial associations, End-use industries.
Who can buy this report?
Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.
Table of Contents
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 COVID-19 Impact Analysis
4.2 Impact of Ukraine- Russia war
4.3 Impact of ongoing Recession
4.3.1 Introduction
4.3.2 Impact on major economies
4.3.2.1 US
4.3.2.2 Canada
4.3.2.3 Germany
4.3.2.4 France
4.3.2.5 United Kingdom
4.3.2.6 China
4.3.2.7 Japan
4.3.2.8 South Korea
4.3.2.9 Rest of the World
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. Global DRAM Module and Component Market Segmentation, by type
8.1Introduction
8.2 DDR2 DRAM
8.3 DDR3 DRAM
8.4 DDR4 DRAM
8.5 DDR5 DRAM
8.6 LPDRAM
8.7 GDDR
8.8 HBM
8.9 Others
9. Global DRAM Module and Component Market Segmentation, by memory
9.1 Introduction
9.2 Up to 1GB
9.3 2GB
9.4 3-4GB
9.5 6-8GB
9.6 > 8GB
9.7 Other
10. Global DRAM Module and Component Market Segmentation, By End-User Industry
10.1 Introduction
10.2 Consumer Electronics
10.3 Mobile Devices
10.4 Servers
10.5 Computers
10.6 Automobiles
10.7 Others
11. Regional Analysis
11.1 Introduction
11.2 North America
11.2.1 USA
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Germany
11.3.2 UK
11.3.3 France
11.3.4 Italy
11.3.5 Spain
11.3.6 The Netherlands
11.3.7 Rest of Europe
11.4 Asia-Pacific
11.4.1 Japan
11.4.2 South Korea
11.4.3 China
11.4.4 India
11.4.5 Australia
11.4.6 Rest of Asia-Pacific
11.5 The Middle East & Africa
11.5.1 Israel
11.5.2 UAE
11.5.3 South Africa
11.5.4 Rest
11.6 Latin America
11.6.1 Brazil
11.6.2 Argentina
11.6.3 Rest of Latin America
12. Company Profiles
12.1 Micron Technology, Inc.
12.1.1 Financial
12.1.2 Products/ Services Offered
12.1.3 SWOT Analysis
12.1.4 The SNS view
12.2 Samsung Electronics
12.3 Winbond Electronics Corporation
12.4 Corporation Technology
12.5 Kingston Technology Corporation
12.6 SK Hynix Inc
12.7 Nanya Technology Corporation
12.8 Powerchip Technology
12.9 Ramaxel Technology
12.10 SMART Modular Technologies
12.11 Other
13. Competitive Landscape
13.1 Competitive Benchmark
13.2 Market Share analysis
13.3 Recent Developments
14. Conclusion
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