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DRAM Module and Component Market

DRAM Module and Component Market Size, Share & Segment by type (DDR2, DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, LPDRAM, GDDR, HBM, Others) by memory (Up to 1GB, 2GB, 3-4GB, 6-8GB, >8GB) by End-User Industry (Consumer Electronics, Mobile Devices, Servers, Computers, Automobiles, Others), by Regions and Global Forecast 2022-2028

Report Id: SNS/SEMI/1602 | June 2022 | Region: Global | 125 Pages

Report Scope & Overview:

DRAM Module and Component Market Size was valued at USD 95.9 billion in 2021 and is expected to reach USD 105.7 billion by 2028, and grow at a CAGR of 1.4% over the forecast period 2022-2028.

DRAM modules for random access memory (DRAM) flexible memory (DRAM) chips connected to circuit boards DRAM chips are dynamic memory cells of a single transistor that use capacitors to store each component in an adjustable row and column format. It is a type of Random Access Memory (RAM) that requires a capacitor to be constantly charged or updated for data storage. The DRAM module is a powerful memory device; requires power supply to maintain its data. In this way, DRAM modules use flexible memory. Different types of DRAM modules can be selected for their specific features. Examples include synchronous DRAM (SDRAM) modules, extended data modules (EDO), and fast page module (FPM) modules.

DRAM Module and Component Market Revenue Graph

MARKET DYNAMICS: 

KEY DRIVERS:

  • The advent of 5G technology.

  • Increasing Demand for DRAM modules and components.

  • Increased use of high-end smartphones

RESTRAINTS: 

  • Instability in extreme environmental conditions.

OPPORTUNITIES: 

  • Use of Internet of Things (IoT) devices has increased.

CHALLENGES: 

  • Pricing is extremely volatile.

IMPACT OF COVID-19: 

COVID-19 has had a severe impact on the global economy as well as all industries. To stop the plague from spreading, governments in several countries have established borders. The initial phase of the epidemic's global shutdown in many countries has had a significant influence on people's lives and quality of life. As a result, the global supply chain has been shattered. The global economy has shrunk as commodity demand has decreased considerably. Due to the outbreak, which has caused a lack of immature materials, production in all industries has been slowed. Productivity declines are caused by variables such as depreciation and supply chain disruption. 

Outbreak of COVID-19 has had a devastating effect on the supply of mobile devices, computers, and consumer electronics, which are the leading industries of end users of the DRAM module and component market. The closure and suspension of manufacturing operations also hampered economic growth and boosted the global semiconductor industry and created severe shortages of chips, affecting cars, computers, and other industries around the world. However, with this shortage comes the opportunity for investment and the emergence of new players in the semiconductor industry; semiconductor manufacturers are now busy expanding the product.

COMPETITIVE LANDSCAPE:

The key market players in Global DRAM Module and Component Market are Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation, SK Hynix Inc, Nanya Technology Corporation, Powerchip Technology, Ramaxel Technology, SMART Modular Technologies and Other.

MARKET SEGMENTATION:

BY TYPE

  • DDR2 DRAM

  • DDR3 DRAM

  • DDR4 DRAM

  • DDR5 DRAM

  • LPDRAM

  • GDDR

  • HBM

  • Others

BY MEMORY

  • Up to 1GB

  • 2GB

  • 3-4GB

  • 6-8GB

  • 8GB

BY END-USER INDUSTRY

  • Consumer Electronics

  • Mobile Devices

  • Servers

  • Computers

  • Automobiles

  • Others

DRAM Module and Component Market Segment Pie Chart

REGIONAL ANALYSIS:

APAC holds the largest market share of the DRAM module and Components market and is expected to maintain its position as the largest during the forecast period due to the presence of countries such as China and South Korea in the region. China is a major market for memory devices and continues to grow significantly due to its huge demand in the mobile, automotive, and server markets, but it depends on other countries to meet its DRAM requirements. With the launch of "Made in China 2025" in 2015, the Chinese government, in partnership with private actors, began investing billions of dollars in developing their semiconductor industry with the aim of closing the gap between domestic production and consumption. South Korea, on the other hand, is a leader in the production of mobile devices, servers, consumer electronics, computers, and the DRAM module and components for corporate presence.

REGIONAL COVERAGE:

  • North America

    • USA

    • Canada

    • Mexico

  • Europe

    • Germany

    • UK

    • France

    • Italy

    • Spain

    • The Netherlands

    • Rest of Europe

  • Asia-Pacific

    • Japan

    • South Korea

    • China

    • India

    • Australia

    • Rest of Asia-Pacific

  • The Middle East & Africa

    • Israel

    • UAE

    • South Africa

    • Rest of Middle East & Africa

  • Latin America

    • Brazil

    • Argentina

    • Rest of Latin America

 

DRAM Module and Component Market Report Scope:
Report Attributes Details
Market Size in 2021 US$ 95.9 Billion
Market Size by 2028 US$ 105.7 Billion
CAGR CAGR of 1.4% From 2022 to 2028
Base Year 2021
Forecast Period 2022-2028
Historical Data 2017-2020
Report Scope & Coverage Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segments • by type (DDR2, DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, LPDRAM, GDDR, HBM, Others)
• by memory (Up to 1GB, 2GB, 3-4GB, 6-8GB, >8GB)
• by End-User Industry (Consumer Electronics, Mobile Devices, Servers, Computers, Automobiles, Others)
Regional Analysis/Coverage North America (USA, Canada, Mexico), Europe
(Germany, UK, France, Italy, Spain, Netherlands,
Rest of Europe), Asia-Pacific (Japan, South Korea,
China, India, Australia, Rest of Asia-Pacific), The
Middle East & Africa (Israel, UAE, South Africa,
Rest of Middle East & Africa), Latin America (Brazil, Argentina, Rest of Latin America)
Company Profiles Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation
Key Drivers • The advent of 5G technology.
• Increasing Demand for DRAM modules and components
Restraints • Instability in extreme environmental conditions.


Frequently Asked Questions (FAQ) :

The DRAM Module and Component Market size was valued at 95.9 billion in 2021 at a CAGR of 1.4%.

APAC is the greatest DRAM module and Components market and is expected to maintain its position as the largest during the forecast period due to the presence of countries such as China and South Korea in the region.

The key market players in Global DRAM Module and Component Market are Samsung Electronics, Micron Technology, Inc, Winbond Electronics Corporation, Corporation Technology, Kingston Technology Corporation, SK Hynix Inc, Nanya Technology Corporation, Powerchip Technology, Ramaxel Technology, SMART Modular Technologies and Other.

Yes, and they are Raw material vendors, Distributors/traders/wholesalers/suppliers, Regulatory authorities, including government agencies and NGO, Commercial research & development (R&D) institutions, Importers and exporters, Government organizations, research organizations, and consulting firms, Trade/Industrial associations, End-use industries.

Manufacturers, Consultants, Association, Research Institutes, private and university libraries, suppliers, and distributors of the product.


Table of Contents

 

1. Introduction

1.1 Market Definition

1.2 Scope

1.3 Research Assumptions

 

2. Research Methodology

 

3. Market Dynamics

3.1 Drivers

3.2 Restraints

3.3 Opportunities

3.4 Challenges

 

4. Impact Analysis

4.1 COVID 19 Impact Analysis

4.2 Impact of Ukraine-Russia War

 

5. Value Chain Analysis

 

6. Porter’s 5 forces model

 

7.  PEST Analysis

  

8. Global DRAM Module and Component Market Segmentation, by type

8.1Introduction

8.2 DDR2 DRAM

8.3 DDR3 DRAM

8.4 DDR4 DRAM

8.5 DDR5 DRAM

8.6 LPDRAM

8.7 GDDR

8.8 HBM

8.9 Others

 

9. Global DRAM Module and Component Market Segmentation, by memory

9.1 Introduction

9.2 Up to 1GB

9.3 2GB

9.4 3-4GB

9.5 6-8GB

9.6 > 8GB

9.7 Other

 

10. Global DRAM Module and Component Market Segmentation, By End-User Industry

10.1 Introduction

10.2 Consumer Electronics

10.3 Mobile Devices

10.4 Servers

10.5 Computers

10.6 Automobiles

10.7 Others

 

11. Regional Analysis

11.1 Introduction

11.2 North America

11.2.1 USA

11.2.2 Canada

11.2.3 Mexico

11.3 Europe

11.3.1 Germany

11.3.2 UK

11.3.3 France

11.3.4 Italy

11.3.5 Spain

11.3.6 The Netherlands

11.3.7 Rest of Europe

11.4 Asia-Pacific

11.4.1 Japan

11.4.2 South Korea

11.4.3 China

11.4.4 India

11.4.5 Australia

11.4.6 Rest of Asia-Pacific

11.5 The Middle East & Africa

11.5.1 Israel

11.5.2 UAE

11.5.3 South Africa

11.5.4 Rest

11.6 Latin America

11.6.1 Brazil

11.6.2 Argentina

11.6.3 Rest of Latin America

 

12. Company Profiles

12.1 Micron Technology, Inc.

12.1.1 Financial

12.1.2 Products/ Services Offered

12.1.3 SWOT Analysis

12.1.4 The SNS view

12.2 Samsung Electronics

12.3 Winbond Electronics Corporation

12.4 Corporation Technology

12.5 Kingston Technology Corporation

12.6 SK Hynix Inc

12.7 Nanya Technology Corporation

12.8 Powerchip Technology

12.9 Ramaxel Technology

12.10 SMART Modular Technologies

12.11 Other

 

13. Competitive Landscape

13.1 Competitive Benchmark

13.2 Market Share analysis

13.3 Recent Developments

 

14. Conclusion

 

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Secondary Research

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