Next-Generation Memory Market Size, Share & Segmentation, By Technology (Non-volatile Memory, Volatile Memory), By Wafer Size (200 mm,300 mm), By Application (Consumer Electronics, Enterprise Storage, Automotive & Transportation, Military & Aerospace, Industrial, Telecommunications, Energy & Power, Healthcare, Agricultural, Retail), By Region, and Global Forecast for 2023-2030

 Next-Generation Memory Market Report Scope & Overview:

The Next-Generation Memory Market size was valued at USD 6.3 billion in 2022 and is expected to grow to USD 33.65 billion by 2030 and grow at a CAGR of 23.3% over the forecast period of 2023-2030.

The market for next-generation memory is divided into volatile and non-volatile segments based on technology. The steady state segment held the top spot in 2022 with a share of global revenue of more than 79.6%. High-bandwidth Memory (HBM) and Hybrid Memory Cube (HMC) are two categories for non-volatile memory. The non-volatile technology offers several benefits essential for contemporary companies. Their capacity to store data even in the absence of power is one of their most notable qualities. During the forecast period, the 200 mm segment is expected to grow at a significant CAGR of 18.5%. The semiconductor industry benefits greatly from the use of 200 mm wafer size. Cost-effectiveness is a major advantage since producing smaller wafers is typically more affordable. Businesses looking to cut costs and streamline production processes without sacrificing the performance and quality of next-generation memory components will find this appealing. When smaller production volumes are adequate, 200 mm wafers are especially appealing for specialized applications and niche markets.

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The market is divided into BFSI, consumer electronics, government, telecommunications, IT, and other segments based on application. In 2022, the BFSI segment held a leading position with over 23.0% of the global revenue share. The BFSI industry benefits greatly from the integration of next-generation memory technologies. These solutions' rapidity and effectiveness are essential for enhancing real-time transaction processing and data analytics capabilities. This means that financial institutions can make decisions more quickly and accurately, which is crucial in markets where even milliseconds can have a big impact. Additionally, data integrity is guaranteed by the non-volatile nature of some next-generation memory types, which is crucial for upholding regulatory compliance and preserving trust.

KEY DRIVERS: 

• Growing need for memory modules that offer quick access and low power consumption

High-capacity, quick storage memory is becoming more and more in demand due to the growing volume of data in enterprises and the widespread use of cloud storage solutions. A large portion of the semiconductor industry is driven by the ever-improving performance of advanced goods. Emerging non-volatile memories, such RRAM, MRAM, FeRAM, and NRAM, have been created in response to the need for memory devices with high speed, low power consumption, and great scalability. These technologies offer greater scalability, density, speed, and endurance in comparison to previous technologies. After a command request, the majority of new memory technologies take 1 to 10 ns for their output to fulfill the required specifications.

RESTRAIN:

• Exorbitant production expenses for next-generation memory

High-density DRAM and SRAM have relatively high production costs, and high-bit-density next-generation RAM has relatively high manufacturing costs. These generation memories are also very strong. Manufacturing processes for next-generation memory technologies are frequently more intricate procedures as opposed to conventional memory technologies. These procedures might call for specific tools, supplies, and knowledge increasing expenses. During the initial phases of research and development and manufacturing, next-generation memory technologies might reduce production yields as a result of problems with materials, process variances, or faults. Reduced yields lead to an increased cost per working chip. Certain cutting-edge and pricy materials that are used in some next-generation memory technologies could add to the total cost of manufacturing.

• There are higher design costs

OPPORTUNITY:

• Growing embedded systems and Internet of Things devices

There is a big chance for market participants due to the growing trend of next-generation memories replacing traditional memories. Next-generation memory, such as MRAM and ReRAM, provides non-volatility, low power consumption, and quick read and write speeds. making them appropriate for deployment in loT devices and embedded systems. These memories can help smart devices retain more data, use less energy, and have instant-on capabilities. Because of their high endurance, these memories can withstand numerous read and write cycles without experiencing any degradation. This feature ensures the long-term dependability and longevity of loT and embedded devices, which is crucial in applications where data is updated frequently.

CHALLENGES:

• There are no standardized manufacturing processes

Advanced non-volatile memory technologies including 3D XPoint, MRAM, FRAM, and ReRAM are part of the next-generation memory market. Most of these memories are anticipated to be produced in large quantities over the course of the next few years, currently in the development or early commercialization stages. Therefore, the cost of designing these non-volatile memories would be significantly higher than that of existing memories unless they were produced using conventional manufacturing processes. However, the price of rival memories like DRAM, SRAM, and Flash is getting cheaper every year. This presents a partial obstacle to the market's expansion.

IMPACT OF RUSSIAN UKRAINE WAR

After Russia invaded Ukraine a year ago, the world's energy situation has drastically altered. Rising costs have severely impacted consumers in various parts of the world, and this has all occurred against a geopolitical backdrop where energy security is paramount. Furthermore, the world's reliance on the use of fossil fuels, along with the associated resource volatility and price, has come into stark relief. The war in Ukraine has disrupted the economy, leading to increased calls for an expedited energy transition. a change that would see nations turn from heavily polluting fuels, which are frequently provided by a small number of large producers, to low-carbon energy sources like nuclear and renewables. Not least in Europe, where the conflict's aftereffects have been particularly noticeable. The COVID-19 pandemic and the conflict have led to supply chain disruptions and high inflation, which have highlighted the dangers of relying too much on highly concentrated manufacturing and essential minerals. The combination of these elements has resulted in extensive government initiatives aimed at safeguarding industry and consumers from the skyrocketing costs of energy and technology. In order to avoid making the same mistakes twice and to expedite the transition to clean energy while also promoting economic recovery, numerous nations and regions are currently examining how they can use policy. A few instances of politicians acting boldly are the US Inflation Reduction Act, the European Union's REPowerEU plan, and Japan's GX Green Transformation program.

IMPACT OF ONGOING RECESSION

For families, estate and succession planning can be a sensitive subject. Regular interaction To prevent needless distress, communication between parents, kids, and their family attorneys can be essential. This may include having a family constitution and guiding principles for succession that serve as a North Star in certain families. Setting up pre- and post-nuptial agreements requires careful consideration of communication. Families now seem to have let go of the notion that pre- and post-nuptial agreements are incongruous. Says Sarah Balfour, partner in family law at Inwin Mitchell 7, "People are being a lot more practical in embracing these documents and see them as a valuable wealth protection tool." These talks must be handled carefully even though they are a useful safeguard against losing money. Durable outcomes Individual experience personal convictions and decisions for many years to come. Individual expectations and risk-taking are more strongly influenced by recent experiences than by those from earlier in life, though significant sufficient shocks cause noticeable effects in people even decades later. Experience effects are context- or domain-specific They don't change people's attitudes toward risk in general or their beliefs in a way that would seem to be in line with correlational structures in physical theory. In contrast, neo-classical economic models suggest that knowledge and experience are transferred across domains. Consequently, the agent might seem to have a set of convictions that are not in line with conventional are at odds with conventional rationality theories. Sturdiness to specialized knowledge enduring consequences of one's own experiences are seen not just with inexperienced individual investors or buyers, but even among highly qualified and skilled people, even in their field of proficiency.

MARKET SEGMENTATION

By Technology:

•  Non-volatile Memory

  • Magneto-resistive Randon-Access Memory (MRAM)

    • Spin-transfer torque magnetic random-access memory (STT-MRAM)

    • Spin-orbit torque magnetic random-access memory (SOT-MRAM)

    • Toggle mode MRAM

  • Ferroelectric RAM (FRAM)

  • Resistive Random-Access Memory (RERAM)/Conductive-Bridging RAM

  • (CBRAM)

  • 3D XPoint

  • Nano RAM (NRAM)

  • Others (Nanobridge, Quantum Dots, Millipede, Molecular, And Transparent/Flexible Memories)

• Volatile Memory

  • Hybrid Memory Cube (HMC)

  • High-Bandwidth Memory (HBM)

By Wafer Size:

• 200 mm

• 300 mm

By Application:

• Consumer Electronics

• Enterprise Storage

• Automotive & Transportation

• Military & Aerospace

• Industrial

• Telecommunications

• Energy & Power

• Healthcare

• Agricultural

• Retail

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REGIONAL ANALYSIS

North America is anticipated to grow at a CAGR of 17.8%. Next-generation memory technologies are being rapidly adopted in the North American region due to a number of important factors. Businesses are being forced to adopt cutting-edge solutions by the unwavering demand for faster data processing capabilities in the cloud computing, healthcare, and finance sectors. Companies are aware that meeting changing customer expectations and staying competitive require these speed and efficiency gains. Second, the growing semiconductor and technology industries in North America encourage research and development in memory technologies.

Asia Pacific had a revenue share of more than 49.0% in 2022, leading the market as a whole. The region is experiencing a rapid uptake of next-generation memory technology due to a combination of factors that complement the ever-changing business environment in the area. The need for energy-efficient memory solutions to store data in power-off scenarios has increased due to the exponential growth of mobile technology and loT devices throughout Asia Pacific countries. The proliferation of smart devices and the tech-savvy consumer base in the region are directly responsible for this demand. Second, Asia Pacific is a hotspot for the production of semiconductors due to its strong manufacturing ecosystem. This placement makes it easier for cutting-edge memory technologies to be quickly integrated into a variety of gadgets, such as smart appliances and smartphones.

REGIONAL COVERAGE:

North America

• US

• Canada

• Mexico

Europe

• Eastern Europe

  • Poland

  • Romania

  • Hungary

  • Turkey

  • Rest of Eastern Europe

• Western Europe

  • Germany

  • France

  • UK

  • Italy

  • Spain

  • Netherlands

  • Switzerland

  • Austria

  • Rest of Western Europe

Asia Pacific

• China

• India

• Japan

• South Korea

• Vietnam

• Singapore

• Australia

• Rest of Asia Pacific

Middle East & Africa

• Middle East

  • UAE

  • Egypt

  • Saudi Arabia

  • Qatar

  • Rest of Middle East

• Africa

  • Nigeria

  • South Africa

  • Rest of Africa

Latin America

• Brazil

• Argentina

• Colombia

• Rest of Latin America

KEY PLAYERS

Major vendors in the next-generation memory companies include SAMSUNG (South Korea), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), Fujitsu (Japan), SK Hynix Inc (South Korea), Honeywell International, Inc. (US), Winbond (Taiwan), Microchip Technology Inc. (US), Nanya Technology (Taiwan), and Everspin Technologies (US). Apart from this, Macronix International Co., Ltd. (Macronix), Kingston Technology (US), Infineon Technologies AG (Germany), ROHM CO., LTD. (Japan), and other players are listed in a final report.

SAMSUNG (South Korea)-Company Financial Analysis

RECENT DEVELOPMENT

• The industry's first 12-layer HBM31 device with a 24 gigabit (GB)2 memory capacity was developed in April 2023 by SK Hynix Inc. (South Korea), making it the largest in the market at the time. After the world's first mass-produced 24 GB package, the company was able to build a product that improved memory capacity by 50% compared to the previous one in June 2022, the first HBM3.

• Everspin Technologies Inc. (US) declared in May 2022 that the STT-MRAM EMxxLX xSPI Family with densities would be available between 8 Mbit and 64 Mbit.

• In March 2022, the Japanese company Fujitsu Semiconductor Memory Solution Limited declared that a 12Mbit ReRAM (Resistive Random Access Memory), the highest density model in Fujitsu's ReRAM product line, is MB85AS12MT. MB85AS12MT is a non-volatile memory that runs at a broad power supply voltage range of 1.6V to 3.6V and has a 12Mbit memory density.

  Next-Generation Memory Market Report Scope:

  Report Attributes	Details
  Market Size in 2022	US$ 6.3 billion
  Market Size by 2030	US$ 33.65 billion
  CAGR	CAGR of 23.3%    From 2023 to 2030
  Base Year	2022
  Forecast Period	2023-2030
  Historical Data	2019-2021
  Report Scope & Coverage	Market Size, Segments Analysis, Competitive  Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
  Key Segments	By Technology (Non-volatile Memory, Volatile Memory), By Wafer Size (200 mm,300 mm), By Application (Consumer Electronics, Enterprise Storage, Automotive & Transportation, Military & Aerospace, Industrial, Telecommunications, Energy & Power, Healthcare, Agricultural, Retail)
  Regional Analysis/Coverage	North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe] Germany, France, UK, Italy, Spain, Netherlands, Switzerland, Austria, Rest of Western Europe]), Asia Pacific (China, India, Japan, South Korea, Vietnam, Singapore, Australia, Rest of Asia Pacific), Middle East & Africa (Middle East [UAE, Egypt, Saudi Arabia, Qatar, Rest of Middle East], Africa [Nigeria, South Africa, Rest of Africa], Latin America (Brazil, Argentina, Colombia Rest of Latin America)
  Company Profiles	SAMSUNG (South Korea), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), Fujitsu (Japan), SK Hynix Inc (South Korea), Honeywell International, Inc. (US), Winbond (Taiwan), Microchip Technology Inc. (US), Nanya Technology (Taiwan), and Everspin Technologies (US). Apart from this, Macronix International Co., Ltd. (Macronix), Kingston Technology (US), Infineon Technologies AG (Germany), ROHM CO., LTD. (Japan),
  Key Drivers	•Growing need for memory modules that offer quick access and low power consumption
  Market Restrains	•Exorbitant production expenses for next-generation memory •There are higher design costs