Key Segmentation
By Type
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Multilayer Mask Blanks
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Phase-Shifting Mask Blanks
By Substrate Material
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Low Thermal Expansion Material
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Fused Silica
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Quartz
By Application
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Logic/IC
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Memory Devices
By End-User
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Foundries
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Integrated Device Manufacturers (IDMs)
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Research Institutions
Regional Coverage:
North America
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United States
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Canada
Europe
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Germany
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United Kingdom
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France
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Italy
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Spain
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Russia
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Poland
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Rest of Europe
Asia Pacific
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China
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India
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Japan
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South Korea
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Australia
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ASEAN Countries
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Rest of Asia Pacific
Middle East & Africa
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UAE
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Saudi Arabia
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Qatar
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South Africa
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Rest of Middle East & Africa
Latin America
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Brazil
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Argentina
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Mexico
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Colombia
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Rest of Latin America
Available Customization
With the given market data, SNS Insider offers customization as per the company’s specific needs. The following customization options are available for the report:
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Detailed Volume Analysis
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Criss-Cross segment analysis (e.g. Product X Application)
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Competitive Product Benchmarking
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Geographic Analysis
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Additional countries in any of the regions
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Customized Data Representation
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Detailed analysis and profiling of additional market players
Frequently Asked Questions
Key players include Hoya Corporation, AGC Inc., Shin-Etsu Chemical, Applied Materials, Photronics, S&S Tech, Toppan, Corning, SCHOTT, and SK hynix, among others.
Continued advancement of high-NA EUV compatible mask blanks and the rising importance of supply chain diversification represent the two most significant opportunities shaping the market's next phase of growth.
Growth is primarily driven by the relentless demand for higher density semiconductor devices, combined with expanding global EUV-capable fabrication capacity.
By End-User, Foundries dominated the market with a 54.80% share in 2025, reflecting the concentration of leading-edge chip production among a small number of pure-play foundries.
Asia Pacific dominated the market with a 71.10% share in 2025, supported by the region's overwhelming concentration of EUV-capable fabrication facilities, led by Taiwan.
